Integrated Coupled Inductor Structure for Magnetic Shielding
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Solution Overview
Problem
Conventional ring-typed coil coupled inductors face challenges with magnetic shielding efficacy, magnetic saturation, and complex, costly manufacturing processes, particularly with miniaturization leading to assembly difficulties and unstable coil lengths.
Innovation Solution
An integrated-type coupled inductor design featuring a lead frame with pins and magnetic packing components, allowing for the use of mechanical or laser stripping to remove insulation layers, enabling stable coil welding and assembly with soft magnetic powders for enhanced magnetic shielding and cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If double-wire winding with high temperature resistance insulating layer is used, then magnetic shielding function is improved, but manufacturing process becomes complicated and cost increases
Solution Approach 1:
The patent extracts and removes the insulating layer from the copper wire before winding, eliminating the need for high temperature resistance insulating layers and laser stripping processes. This simplifies the manufacturing process while maintaining magnetic shielding function through the integrated structure design.
Solution Approach 2:
The patent merges the coil structure with the magnetic shielding structure into an integrated design where the magnetic shielding function is achieved through the overall structure rather than relying on insulating layers, thereby simplifying the manufacturing process.
2Object-affected harmful factors
If double-wire winding with insulating layer is used, then magnetic shielding function is improved, but coil length becomes unstable
Solution Approach 1:
The insulating layer is removed entirely from the copper wire, eliminating the variability introduced by insulating layer thickness and allowing for precise control of coil length through direct wire winding without insulation interference.
3Volume of moving object
If miniaturization is applied to passive components, then product size is reduced, but assembly difficulty increases
Solution Approach 1:
The patent combines multiple functions (coil, magnetic shielding, structural support) into a single integrated structure, reducing the number of separate components that need to be assembled and thereby simplifying the assembly process despite miniaturization.
Solution Approach 2:
The integrated structure is designed with segmented functional zones that can be manufactured separately and then easily assembled, or as a single piece that eliminates assembly steps entirely, resolving the assembly difficulty caused by miniaturization.
4Productivity
If assembly-typed coupled inductor is used, then mass production is improved, but magnetic shielding efficacy is insufficient
Solution Approach 1:
The patent merges the coil structure with the magnetic shielding structure into an integrated design where the magnetic shielding function is achieved through the overall structure rather than separate assembly components, maintaining mass production capability while improving magnetic shielding efficacy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated-type coupled inductor achieves improved magnetic shielding, avoids magnetic saturation, and simplifies the manufacturing process with stable coil lengths, enabling flexible circuit design and reduced costs.
Implementation Method 1
the magnetic packing component covers the first coil and the second coil
Implementation Method 2
welding two ends of the first coil respectively to two pins on a first surface of a lead frame
Data Source
AI summary
An integrated-type coupled inductor is applied to a related manufacturing method and includes a lead frame, a first coil, a second coil and a magnetic packing component. The lead frame has a first surface and a second surface opposite to each other and includes four pins. The first coil is disposed on the first surface and coupled to two of the four pins. The second coil is disposed on the second surface and coupled to other pins. The magnetic packing component covers the first coil and the second coil to expose parts of the four pins.