Integrated Current Sensing Package for Low-Impedance Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing current sensing technologies face challenges in accurately monitoring current due to contact impedance from soldering and noise interference, leading to inaccurate measurements.
Innovation Solution
A current sensing device comprising a lead frame and a sensor die, packaged together using flip chip or wire bonding technology, reduces contact impedance and minimizes noise interference, enabling precise current measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional soldering method is used to connect current sensing device to PCB, then device assembly is simple, but contact impedance increases and measurement precision deteriorates
Solution Approach 1:
The patent merges the current sensing device with the PCB trace by integrating the lead frame directly into the PCB structure. The lead frame's first and second pads are formed as part of the PCB trace, eliminating the need for separate soldering connections and reducing contact impedance. This integration combines multiple functions (current path, sensing interface, and mechanical support) into a single unified structure.
2Reliability
If additional soldering is used for connection, then electrical connection is established, but contact impedance increases and noise resistance deteriorates
Solution Approach 1:
The patent extracts and eliminates the soldering process from the assembly. By forming the lead frame pads directly as part of the PCB trace through printing or other direct formation methods, the invention removes the harmful soldering step that introduces contact impedance and noise. This extraction simplifies the manufacturing process while improving electrical connection quality.
3Measurement precision
If lead frame and sensor die are packaged together, then contact impedance is reduced, but manufacturing process becomes more complex
Solution Approach 1:
The patent merges the lead frame and sensor die into a single integrated package where the lead frame serves dual purposes: providing electrical connections and supporting the sensor die. This integration reduces contact impedance by eliminating intermediate connection points while the unified structure simplifies packaging requirements compared to separate component assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated design provides accurate current monitoring with reduced error values, enhancing measurement precision and reducing component costs by eliminating the need for additional soldering and improving noise resistance.
Implementation Method 1
The sensor die obtains current information which is the current passing through the connection line according to a voltage difference between the first and second pads and an equivalent impedance of the connection line
Data Source
AI summary
A current sensing device including a lead frame and a sensor die is provided. The lead frame includes a first pad, a second pad, a third pad, and a connection line. The first pad is coupled to a first power source and receives a specific current provided by the first power source. The second pad is coupled to a load. The third pad provides a data signal to a microcontroller. The connection line is electrically coupled to the first and second pads. The sensor die obtains current information which is a current passing through the connection line according to a voltage difference between the first and second pads and an equivalent impedance of the connection line. The sensor die provides the data signal according to the current information. The lead frame is packaged together with the sensor die.