Integrated Current Sensor Layout for Compact Power Electronics Modules

Solution Overview

Problem

Existing power electronics units for electric drives are complex and require significant installation space and manufacturing effort due to separate current sensors, which complicates current measurement.

Innovation Solution

Integrating a current sensor with the power semiconductor module and carrier element, either directly or through a conductor rail, to create a compact and modular design that simplifies manufacturing and reduces space requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If current sensors are connected as separate component units behind the power semiconductor module, then current measurement is reliable, but installation space increases and manufacturing effort increases

Engineering Contradiction:

Improvecurrent measurement reliabilityVSAvoidconstruction complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The current sensor is integrated directly into the power semiconductor module, merging two previously separate components (current sensor and power semiconductor module) into a single unified structure. This integration eliminates the need for separate component units and connections, thereby reducing installation space and manufacturing effort while maintaining reliable current measurement capability within the merged module

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If current sensors are connected as separate component units behind the power semiconductor module, then current measurement is reliable, but installation space increases

Engineering Contradiction:

Improvecurrent measurement reliabilityVSAvoidinstallation space

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The current sensor is integrated directly into the power semiconductor module, merging two previously separate components (current sensor and power semiconductor module) into a single unified structure. This integration eliminates the need for separate component units and connections, thereby reducing installation space and manufacturing effort while maintaining reliable current measurement capability within the merged module

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If current sensors are connected as separate component units behind the power semiconductor module, then current measurement is reliable, but manufacturing effort increases

Engineering Contradiction:

Improvecurrent measurement reliabilityVSAvoidmanufacturing effort

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The current sensor is integrated directly into the power semiconductor module, merging two previously separate components (current sensor and power semiconductor module) into a single unified structure. This integration eliminates the need for separate component units and connections, thereby reducing installation space and manufacturing effort while maintaining reliable current measurement capability within the merged module

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS11839044B2Power electronics unit having an integrated current sensor for forming a module; and drive train

Publication Date: 2023.12.05 SCHAEFFLER TECHNOLOGIES AG & CO KG

AI summary

A power electronics unit (1) for an electric drive unit, having an electrically conductive carrier element (2) and a power semiconductor module (3) arranged on the carrier element (2). The power semiconductor module (3) is designed to convert a direct current into a three-phase alternating current, and a current sensor (4) used to determine the alternating current is integrated such that it forms a main module (5) with the carrier element (2) and the power semiconductor module (3). A drive train for a motor vehicle having such a power electronics unit (1) is also provided.