Integrated Curved Diffraction Grating Laser System
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Solution Overview
Problem
Existing semiconductor laser systems based on diffraction gratings are mechanically fragile, heavy, and require discrete optical components that are tedious to align, making them bulky and costly, while lacking in wall-plugged electrical power efficiency.
Innovation Solution
A fully integrated diffraction-grating based semiconductor laser system on a single chip, utilizing an integrated curved diffraction grating combined with Bragg-grating reflectors, which eliminates the need for optical lenses and integrates multiple optical components, enabling compact, lightweight, and cost-effective high-power operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If discrete optical components are used to build diffraction-grating semiconductor lasers, then wavelength selectivity can be achieved, but the system becomes mechanically fragile, heavy, and difficult to align
Solution Approach 1:
The patent integrates multiple discrete optical components (diffraction grating, lenses, mirrors) onto a single semiconductor chip, creating a monolithic integrated laser system. This merging eliminates the mechanical fragility and alignment difficulties of discrete components while preserving wavelength selectivity through the integrated diffraction grating structure
Solution Approach 2:
The patent replaces the mechanical assembly of discrete optical components with an integrated photonic circuit implementation. The diffraction grating is implemented as an integrated optical component on the semiconductor chip, eliminating the need for mechanical mounting and alignment of separate optical elements
2Measurement precision
If discrete optical components are used in diffraction-grating semiconductor lasers, then wavelength selectivity is achieved, but the system becomes heavy and bulky
Solution Approach 1:
By combining all optical components into a single integrated semiconductor laser chip, the patent dramatically reduces the overall system weight and volume. The integrated structure eliminates the need for separate mounting hardware, alignment mechanisms, and housing required for discrete optical components
Solution Approach 2:
The patent transitions from a three-dimensional mechanical assembly of discrete optical components to a two-dimensional integrated circuit layout on a semiconductor chip. This dimensional transformation enables compact packaging and significantly reduces the system's physical footprint and weight
3Measurement precision
If discrete optical components are used to build diffraction-grating semiconductor lasers, then wavelength selectivity can be achieved, but alignment becomes tedious and complex
Solution Approach 1:
The patent integrates the diffraction grating and other optical components directly onto the semiconductor chip in fixed positions, eliminating the need for post-fabrication alignment. The integrated structure ensures precise spatial relationships between components are maintained automatically through the fabrication process
Solution Approach 2:
The integrated design allows the laser system to self-align through the precise fabrication processes used to create the photonic circuit. The relative positions of optical components are determined by the fabrication mask and processing steps, eliminating the need for manual alignment procedures
4Power
If traditional discrete component systems are used, then laser functionality is achieved, but manufacturing cost increases and power efficiency decreases
Solution Approach 1:
The patent integrates the gain medium, diffraction grating, and optical resonator components into a single semiconductor chip, reducing optical losses at interfaces and improving overall system efficiency. The integrated structure minimizes coupling losses and enables more efficient electrical-to-optical power conversion
Solution Approach 2:
The patent optimizes the electrical and optical parameters of the integrated laser structure to improve wall-plugged efficiency. By controlling the current injection, optical confinement, and cavity design at the integrated level, the system achieves higher electrical-to-optical conversion efficiency compared to discrete component systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, lightweight, and cost-effective laser system with high wall-plugged electrical power efficiency and optical power output, overcoming the limitations of traditional systems by integrating all necessary components onto a single chip.
Implementation Method 1
a fully integrated diffraction-grating based laser that do not need the use of any optical lens
Implementation Method 2
an integrated curved diffraction grating combined with one or more integrated Bragg-grating reflectors
Data Source
AI summary
It is an aim of the present invention to provide ultra-compact highly-integrated diffraction-grating semiconductor lasers on chips. Various embodiments combined enable the lasers to be compact in size, light weight, mechanically rugged, low in manufacturing cost, and in some cases high in electrical wall-plugged power efficiency or high in optical power output, comparing to typical lasers based on discrete optical components.