Integrated DC/DC Converter Substrate Connections for PoE

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Solution Overview

Problem

Magnetic transformers used in power over Ethernet (PoE) systems are cumbersome, costly, and prone to failures, limiting current transmission and causing electromagnetic interference, while also posing challenges in providing ground protection and isolating signals.

Innovation Solution

An integrated circuit (IC) that combines non-magnetic transfer and choke circuitry, DC-DC power converter, and Ethernet physical layer (PHY) module on a common substrate, providing a shared ground to prevent floating and exposure to high voltages, thus eliminating the need for magnetic transformers and enhancing system reliability and efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If magnetic transformers are used in PoE systems, then ground protection and signal isolation functions are provided, but device complexity, cost, and electromagnetic interference increase

Engineering Contradiction:
Improveground protection and signal isolationVSAvoidtransformer integration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent segments the transformer functions into separate components: a non-magnetic isolation circuit for ground protection and signal isolation, and a DC-DC converter for power conversion. This segmentation eliminates the need for bulky magnetic transformers while maintaining essential functions through separate, optimized circuits.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent extracts the magnetic transformer from the system and replaces it with non-magnetic circuitry. The isolation and ground protection functions are extracted and implemented through dedicated isolation circuits, while power conversion is handled by a separate DC-DC converter, removing the source of electromagnetic interference.

Inventive Principle:
Principle #2Taking out (Extraction)

2Power

If magnetic transformers are used, then power transmission is enabled, but current transmission is limited and electromagnetic interference occurs

Engineering Contradiction:
Improvepower transmissionVSAvoidelectromagnetic interference
Core Design Contradiction:
PowerVSObject-generated harmful factors

Solution Approach 1:

The patent substitutes magnetic field-based power transmission with an electrical circuit-based system. By using a DC-DC converter with controlled switching and a non-magnetic isolation circuit, the system transmits power without generating electromagnetic interference, replacing the magnetic transformer's function with solid-state electronics.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If components are integrated on a common substrate, then system reliability and efficiency improve, but ground floating and exposure to high voltages may occur

Engineering Contradiction:
Improvesystem efficiencyVSAvoidground floating and voltage exposure
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent implements equipotentiality by providing a dedicated ground connection for the low-voltage side of the DC-DC converter through the non-magnetic isolation circuit. This ensures that the ground remains at a stable potential even when integrated on a common substrate, preventing ground floating and protecting sensitive components from voltage exposure.

Inventive Principle:
Principle #12Equipotentiality

Data Source

PatentUS7368798B2Integrated DC/DC converter substrate connections
Publication Date: 2008.05.06 KINETIC TECHNOLOGIES INTERNATIONAL HOLDINGS LP
  • US7368798B2 patent drawing
  • US7368798B2 patent drawing
  • US7368798B2 patent drawing

AI summary

Embodiments of the present invention provide an integrated circuit (IC) having an integrated DC-DC power converter therein. This IC is operable to support the distribution of combined power and data signals in a network environment such as an Ethernet network according to protocols such as the power over Ethernet (PoE) protocol. The IC includes a DC-DC power converter, a power feed circuit, and a network physical layer (PHY) module, wherein the PHY module may contain fine line structures susceptible to damage when exposed to excessive voltages. To prevent or reduce the likelihood of damage to the PHY module from voltages supplied to the DC-DC power converter, a common substrate ground is shared between the IC components.