Integrated Die-Attach Pad Touch Sensor Daisy-Chain
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Solution Overview
Problem
Existing multi-channel touch sensor systems face challenges in uniformly adjusting touch sensitivities between channels, leading to interference signals and varying touch sensitivity, which complicates the construction and tuning of these systems.
Innovation Solution
A semiconductor device with a die-attach pad integrated as a touch pad within the semiconductor package, allowing for simplified sensitivity adjustment and daisy-chain communication mode for continuous touch information transmission, eliminating the need for additional tuning processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple separate touch pads and semiconductor devices are used for multi-channel touch sensor system, then touch information can be sensed across multiple channels, but parasitic capacitance is generated between adjacent channels causing interference signals and sensitivity differences
Solution Approach 1:
The patent merges the touch pad and semiconductor device into a single integrated unit. The touch pad is formed directly on the semiconductor device substrate, with touch sensors positioned above corresponding sensing regions. This integration eliminates the physical separation between touch pads and semiconductor devices, reducing parasitic capacitance between adjacent channels while maintaining multi-channel touch sensing capability.
2Manufacturing precision
If conventional separate touch pads and semiconductor devices are used, then channel coverage is adequate, but additional tuning process is required to adjust sensitivities and uniformize channel characteristics
Solution Approach 1:
The patent incorporates sensitivity adjustment features directly into the manufacturing process. Capacitance adjustment structures are pre-formed during semiconductor fabrication, allowing sensitivity uniformization across channels to be achieved through standard manufacturing processes rather than post-fabrication tuning. This preliminary action eliminates the need for additional manual tuning steps.
3Ease of manufacture
If touch pad is integrated within semiconductor package, then sensitivity adjustment is simplified and fabrication costs are reduced, but communication between multiple devices requires efficient protocol
Solution Approach 1:
The patent implements a universal daisy-chain communication protocol that enables multiple integrated touch sensor devices to be connected in series through a simple daisy-chain topology. Each device can communicate touch information sequentially through standardized interfaces, allowing efficient multi-device communication without complex point-to-point connections. This universal protocol simplifies both manufacturing and inter-device communication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the semiconductor device to simplify the sensitivity adjustment process, reduce fabrication costs, and facilitate the construction of multiple touch sensor systems with uniform sensitivity by integrating the die-attach pad as a touch pad and using a daisy-chain communication mode for efficient touch information transmission.
Implementation Method 1
the die-attach pad generates the touch signal depending on whether a touch object is brought into contact with the package
Data Source
AI summary
Provided are a semiconductor device and a touch sensor device. The semiconductor device includes a die including a sense signal generator for sensing a touch signal to generate a sense signal; a conductive die-attach pad attached to the die to generate the touch signal; and a package for packaging the die and the die-attach pad, wherein the die-attach pad generates the touch signal depending on whether a touch object comes into contact with the package. The touch sensor device includes a plurality of semiconductor devices connected in a daisy-chain communication mode, wherein each of the semiconductor devices includes a die including a sense signal generator for sensing a touch signal to generate a sense signal; a conductive die-attach pad attached to the die to generate the touch signal; and a package for packaging the die and the die-attach pad, wherein the die-attach pad generates the touch signal depending on whether a touch object is brought into contact with the package. The semiconductor device enables the size and position of a touch pad to be known in advance during the fabrication of a die so that a sensitivity adjusting process can be simplified. Also, since the touch pad is included in a touch sensor, a system can be simply configured at low cost. Furthermore, the touch sensor device requires no additional sensitivity adjusting process and enables a plurality of touch sensor systems to be constructed at low cost by simply connecting a small number of electrical signals.