Integrated Die Package Layout for Placement Tolerance Control
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Solution Overview
Problem
Current three-dimensional package-on-package devices face challenges in controlling placement tolerances and relative movement during compression molding, which affects the precision and reliability of integrated circuit packages, particularly in miniaturized medical devices like IMDs and ICDs.
Innovation Solution
The development of an integrated circuit package that includes first and second active dies adapted to emit electromagnetic radiation of different wavelengths, along with a via die, which are disposed on a carrier layer and encapsulated, allowing for the elimination of tight tolerances required in traditional package-on-package devices, and enabling the use of materials like glass or silicon for die cavities and vias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional package-on-package devices are used, then device functionality is achieved, but placement tolerance control and relative movement control during compression molding deteriorate
Solution Approach 1:
The patent merges multiple dies (first active die, second active die, and via die) into a single integrated circuit package structure. The dies are disposed on a carrier layer and encapsulated together, eliminating the need for separate package-on-package assembly. This integration resolves the technical contradiction by achieving both precise placement tolerance control and relative movement control while maintaining device functionality, without the complexity of multi-layer packaging.
2Manufacturing precision
If tight tolerances are required in traditional package-on-package devices, then precision is improved, but manufacturing complexity and difficulty increase
Solution Approach 1:
The patent employs preliminary action by disposing all dies (first active die, second active die, and via die) on the carrier layer before encapsulation. This pre-arrangement allows for precise positioning to be established beforehand, and the subsequent encapsulation process preserves these precise relative positions without requiring tight tolerances during compression molding. This resolves the contradiction by achieving high placement precision while simplifying the manufacturing process.
3Volume of moving object
If miniaturization is pursued in IMDs and ICDs, then device size is reduced, but tolerance control and reliability deteriorate
Solution Approach 1:
The patent implements nesting by placing multiple functional dies (first active die emitting first wavelength, second active die emitting second wavelength, and via die) within a single integrated circuit package. This nested arrangement achieves miniaturization by consolidating multiple components into one compact structure while maintaining precise relative positioning through the carrier layer and encapsulation process, thereby preserving reliability and tolerance control despite reduced device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a more reliable and precise integrated circuit package with improved tolerance control, suitable for miniaturized medical devices, allowing for precise electromagnetic radiation emission and detection, enhancing the functionality and reliability of IMDs and ICDs.
Implementation Method 1
The first active die is adapted to emit electromagnetic radiation having a first wavelength, and the second active die is adapted to emit electromagnetic radiation having a second wavelength
Data Source
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AI summary
Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The integrated circuit package includes first and second active dies. Each of the first and second active dies includes a top contact disposed on the top surface of the die and a bottom contact disposed on a bottom surface of the die. The package further includes a via die having first and second vias that each extends between a top contact disposed on a top surface of the via die and a bottom contact disposed on a bottom surface of the via die, where the bottom contact of the first active die is electrically connected to the bottom contact of the first via of the via die and the bottom contact of the second active die is electrically connected to the bottom contact of the second via of the via die.