Integrated Dielectric Sensor Assembly for Compact Electrochemical Analysis
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electrochemical sensor assemblies are costly and complex to manufacture, especially when dealing with small sample sizes, as they require separate manufacturing processes for sensor structures and packages, and face challenges in condensing sensor sizes while maintaining a high number of electrodes.
Innovation Solution
The sensor assembly integrates electrodes and fluidics into a single package using first and second dielectric layers, where the first layer forms a well or aperture associated with the electrode, and the second layer provides an aperture fluidly connected to the first, allowing for efficient sample delivery and retention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate sensor structures and packages are manufactured independently, then manufacturing flexibility is maintained, but manufacturing cost and complexity increase
Solution Approach 1:
The patent merges the sensor structure and package into a single integrated assembly where the sensor electrodes and fluidic package features are formed together in the same substrate. This integration eliminates the need for separate manufacturing processes and assembly steps, directly reducing manufacturing cost and process complexity while maintaining manufacturing flexibility.
2Volume of moving object
If sensor size is reduced for small sample sizes, then sample volume requirement decreases, but maintaining high electrode density becomes difficult
Solution Approach 1:
The patent applies local quality by creating regions of high electrode density in specific areas of the substrate while maintaining overall compact dimensions. The integrated structure allows electrodes to be closely spaced in the active sensing region without requiring the entire assembly to be large, thus achieving high electrode density in a small volume.
Solution Approach 2:
The patent utilizes three-dimensional integration by forming electrodes and fluidic channels in multiple layers within the substrate. This vertical stacking allows high electrode density to be achieved in a small planar footprint by distributing electrodes across different depths and levels of the integrated structure.
3Device complexity
If integrated sensor and package structure is used, then manufacturing is simplified, but fluidic connection precision must be maintained
Solution Approach 1:
The patent employs preliminary action by forming both the sensor electrodes and the fluidic apertures/channels in the substrate simultaneously during the same manufacturing process sequence. This concurrent formation ensures that the apertures are precisely aligned with the electrodes from the outset, eliminating subsequent alignment operations and maintaining high precision while simplifying the overall manufacturing process.
Data Source
AI summary
The present disclosure provides a sensor assembly for measuring a property of a sample. The sensing assembly comprises first and second dielectric layers. The first dielectric layer provides a well or aperture which is associated with an electrode. The second dielectric layer is provided on the first dielectric layer and provides an aperture fluidly connected to the well or aperture in the first dielectric layer.