Integrated Display Driving Package for Seamless Screen Enlargement

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional display panels face limitations in enlargement due to the complexity of connecting multiple unit display panels or backlight panels, particularly with driver ICs and MCUs, leading to complicated wiring and structure issues.

Innovation Solution

A driving package with an integrated display is developed, comprising a display part and a driving part in a single package, where the display part includes light emitting devices forming pixels, and the driving part includes a semiconductor chip with driver IC circuits, allowing seamless connection without bezels for easy screen enlargement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multiple unit display panels or backlight panels are connected to enlarge the screen, then the screen size is increased, but the wiring and structure become complicated due to difficulty in connecting driver ICs and MCUs

Engineering Contradiction:
Improvescreen sizeVSAvoidwiring and structure complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent combines the display part and driving part into a single integrated package. The driving part includes a semiconductor chip with driver IC circuits that are directly integrated with the display part containing light emitting devices. This merging eliminates the need for separate connections between driver ICs and multiple display panels, thereby reducing wiring complexity and structural complications while enabling easy enlargement of screens by connecting multiple integrated packages.

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If separate driver ICs and MCUs are connected to drive pixels in multiple unit display panels, then the display functionality is extended, but the connectivity is limited and the structure is complicated

Engineering Contradiction:
Improvedisplay functionality extensionVSAvoidconnectivity reliability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The driving part is integrated within the same package as the display part, with the semiconductor chip containing driver IC circuits directly connected to the light emitting devices. This integration improves connectivity reliability by eliminating external connection points and reducing the number of connection interfaces, while still allowing extension of display functionality by connecting multiple integrated packages in series or parallel configurations.

Inventive Principle:
Principle #5Merging (Combining)

3Area of stationary object

If conventional unit panel connecting techniques are used to enlarge screens, then the screen area is increased, but the manufacturing time and cost increase due to complex assembly processes

Engineering Contradiction:
Improvescreen areaVSAvoidmanufacturing efficiency
Core Design Contradiction:
Area of stationary objectVSProductivity

Solution Approach 1:

By integrating the display part and driving part into a single package, the patent reduces the number of assembly steps required. Instead of separately assembling display panels and driver ICs, the integrated package is manufactured as a unified component, thereby reducing manufacturing time and cost while enabling easy enlargement of screens by simply connecting multiple integrated packages together.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables easy enlargement of screens in applications like AR devices, VR devices, and large-screen displays by integrating display and driving parts, reducing manufacturing time and cost while improving productivity and light extraction efficiency.

Implementation Method 1

bonding the wafer for CMOS and the wafer for an LED so that a driving part of the wafer for CMOS and a display part of the wafer for an LED can be electrically connected to each other

Methodology Applied
Scientific EffectWafer bonding: Welding

Implementation Method 2

a display part including a plurality of light emitting devices forming a plurality of pixels

Methodology Applied
Scientific EffectLight emitting diode effect: Light Emitting Diode

Implementation Method 3

light emitting devices forming a plurality of pixels so that an entire screen or a portion of the screen can be displayed

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 4

cutting the wafer for CMOS and the wafer for an LED which are bonded, into a unit package

Methodology Applied
Scientific EffectWafer dicing: Fracture Mechanics

Data Source

PatentUS12567360B2Driving package with integrated display and manufacturing method thereof
Publication Date: 2026.03.03 GLOBAL TECH CO LTD
  • US12567360B2 patent drawing
  • US12567360B2 patent drawing
  • US12567360B2 patent drawing

AI summary

The present disclosure relates to a driving package with an integrated display and a method thereof for using as a display application or a lighting application and may include a display part configured of a plurality of light emitting devices forming a plurality of pixels so that an entire screen or a portion of the screen can be displayed; and a driving part including the display part on one side and a terminal part on another side, driving the light emitting devices.