Integrated Display Panel with Shared Semiconductor Layers
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Solution Overview
Problem
Existing display panels with integrated fingerprint identification units have a large overall thickness due to the external placement of fingerprint identification units, which hinders the achievement of lightweight and thin designs.
Innovation Solution
The display panel integrates light-emitting units and fingerprint identification units on the same substrate, with shared semiconductor layers forming a PN junction, allowing for sequential arrangement on the substrate plane, eliminating the need for external fingerprint identification units and reducing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external fingerprint identification units are adhered to the base substrate with optical cement, then fingerprint identification function is achieved, but overall thickness of the display panel increases
Solution Approach 1:
The patent merges the fingerprint identification unit with the light-emitting unit by integrating the photosensitive diode and light-emitting diode into a single stacked structure. The N-type semiconductor layer serves as a shared layer between both functions, eliminating the need for separate external fingerprint identification units and reducing overall panel thickness while maintaining fingerprint identification capability.
Solution Approach 2:
The patent transitions from a planar arrangement where fingerprint identification units are placed externally on the substrate to a vertical stacked arrangement. By stacking the N-type semiconductor layer, P-type semiconductor layer, and active layers in multiple dimensions, the design achieves both light emission and fingerprint identification functions within a compact vertical space, reducing the overall thickness of the display panel.
2Reliability
If external fingerprint identification units are used, then fingerprint identification is enabled, but device complexity increases
Solution Approach 1:
The patent combines multiple functional units (light-emitting unit and fingerprint identification unit) into a single integrated structure. The N-type semiconductor layer and P-type semiconductor layer are shared between both functions, reducing the number of separate components and simplifying the overall device structure while maintaining both light emission and fingerprint identification capabilities.
Solution Approach 2:
The patent designs the N-type semiconductor layer and P-type semiconductor layer to serve multiple functions simultaneously. These semiconductor layers are used both for light emission in the light-emitting unit and for detecting reflected light in the fingerprint identification unit, achieving multi-functionality with a single structure and reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces the overall thickness of the display panel, enhances fabrication efficiency, and facilitates lightweight and thin designs while maintaining fingerprint identification functionality.
Implementation Method 1
Each of the plurality of light-emitting units includes a first N-type semiconductor layer and a first P-type semiconductor layer, each of the plurality of fingerprint identification units includes a second N-type semiconductor layer and a second P-type semiconductor layer
Implementation Method 2
each of the plurality of light-emitting units includes a first N-type semiconductor layer and a first P-type semiconductor layer
Implementation Method 3
each of the plurality of fingerprint identification units includes a second N-type semiconductor layer and a second P-type semiconductor layer
Data Source
AI summary
Provided are a display panel, a manufacturing method thereof and a display device. The display panel includes: a first substrate and a second substrate disposed opposite to each other, and a plurality of light-emitting units and a plurality of fingerprint identification units, disposed on one side of the first substrate facing to the second substrate. Each of the plurality of light-emitting units includes a first N-type semiconductor layer and a first P-type semiconductor layer, each of the plurality of fingerprint identification units includes a second N-type semiconductor layer and a second P-type semiconductor layer. The first N-type semiconductor layer and the second N-type semiconductor layer are disposed in a same layer, and the first P-type semiconductor layer and the second P-type semiconductor layer are disposed in a same layer.


