Integrated Downhole Electronics Package Minimizing Volume
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Solution Overview
Problem
Traditional printed circuit boards (PCBs) are bulky and costly, making them inefficient for use in downhole tools for hydrocarbon exploration and production.
Innovation Solution
The development of compact electronics packages that eliminate the need for PCBs or ceramic mounting structures, using a transducing substrate with sensing elements and electronic components connected directly without flexible connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional printed circuit boards are used in downhole tools, then electronic components can be mounted and connected, but the size becomes bulky and cost increases
Solution Approach 1:
The patent merges the PCB substrate, sensing elements, and electronic components into a single integrated electronics package. The PCB provides both mechanical support and electrical interconnections, while sensing elements are directly formed on the PCB, eliminating the need for separate mounting structures and reducing overall volume.
Solution Approach 2:
The PCB is designed to serve multiple functions simultaneously: it acts as the structural substrate, provides electrical interconnections through traces, supports mounting of electronic components, and incorporates sensing elements directly. This multi-functionality eliminates the need for separate PCB and sensor assemblies, reducing space requirements.
2Reliability
If traditional printed circuit boards are used in downhole tools, then electronic components can be mounted and connected, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple manufacturing steps into a unified process. Sensing elements are formed directly on the PCB during PCB manufacturing using screen printing or other deposition techniques, eliminating separate sensor assembly steps. Electronic components are mounted using standard PCB mounting techniques, streamlining the overall manufacturing process.
Solution Approach 2:
The invention changes the manufacturing parameters by forming sensing elements directly on the PCB substrate using conventional PCB manufacturing techniques rather than requiring separate sensor fabrication and assembly processes. This integration leverages existing PCB manufacturing capabilities, reducing overall manufacturing complexity and cost.
3Ease of manufacture
If flexible connections are used to connect sensing elements to electronic components, then assembly is easier, but reliability decreases in harsh downhole environments
Solution Approach 1:
The patent eliminates flexible connections by integrating sensing elements directly onto the rigid PCB substrate. Electrical interconnections are provided through rigid PCB traces that are inherently part of the PCB structure, not separate flexible connectors. This integration maintains reliability in harsh downhole environments while preserving manufacturability through standard PCB fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution minimizes space requirements and enhances the robustness of downhole electronics, enabling more efficient data storage, processing, and communication in harsh downhole environments.
Implementation Method 1
a transducing element configured to transduce one or more of a strain, a bending, a force, a torque, a pressure, a temperature, a dilatation, and a contraction into a signal
Implementation Method 2
a sensing element configured to sense the transduced property and generate a signal in response to the sensed transduced property
Implementation Method 3
The layers may include one or more electrically insulating layers, one or more electrically conductive layers, and one or more protection layers formed using known thin-film deposition processes such as sputtering
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
An apparatus for use in a wellbore may include a transducing element transducing a first property into a second property, a sensing element generating a signal in response to the second property, a layer deposited on the transducing element and defining a track, and an active electronic component. The sensing element is fixedly connected to the transducing element. The active electronic component is fixedly connected to the transducing element and is in communication with the sensing element via the track. A related method forms a downhole tool with the apparatus and operates the downhole tool in the wellbore.