Integrated Driver Chip for Image Sensing and Light Emission
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Solution Overview
Problem
Traditional methods for integrating image sensing and light-emitting functions into electronic elements require separate chips, leading to high manufacturing costs, excessive volume, and high power consumption.
Innovation Solution
A driver chip is designed with a wafer substrate that integrates a light-emitting module, including a photodiode and image sensing circuit on one surface and a light-emitting driving circuit on the other, allowing for simultaneous image sensing and light-emitting capabilities while sharing functional circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate chips are used for image sensing and light-emitting functions, then functional independence is maintained, but manufacturing cost increases and device volume becomes excessive
Solution Approach 1:
The patent merges the image sensing function (photodiode) and light-emitting function (light-emitting module) into a single driver chip. The photodiode and light-emitting module are both integrated on the same wafer substrate, eliminating the need for separate chips and reducing manufacturing cost while maintaining functional independence through dedicated circuit paths.
Solution Approach 2:
The driver chip is designed with multi-functionality, serving both as an image sensor driver and a light-emitting module driver. The wafer substrate integrates multiple functional circuits including the image sensing circuit and light-emitting driving circuit, allowing a single chip to perform multiple functions that traditionally required separate components.
2Volume of moving object
If separate chips are used for image sensing and light-emitting functions, then functional independence is maintained, but device volume increases
Solution Approach 1:
The patent combines the image sensing circuit and light-emitting driving circuit into a single integrated driver chip structure. By merging these functions on one wafer substrate with shared connection units, the overall device volume is reduced compared to using separate chips, while the internal circuit architecture maintains functional independence.
Solution Approach 2:
The driver chip employs a nested structure where the photodiode, image sensing circuit, light-emitting driving circuit, and connection units are integrated within the wafer substrate. The light-emitting module is then mounted on this integrated substrate, creating a compact nested arrangement that minimizes device volume while preserving functional separation.
3Use of energy by moving object
If separate chips are used for image sensing and light-emitting functions, then functional independence is maintained, but power consumption increases
Solution Approach 1:
The patent merges the image sensing and light-emitting functions into a single integrated driver chip, reducing the total number of components and interconnections. This integration reduces power consumption by eliminating redundant circuitry and reducing the energy required for signal transmission between separate chips, while the internal design maintains functional independence through dedicated circuit paths.
4Ease of manufacture
If multiple chips are packaged together, then functional requirements are met, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple functional circuits (image sensing driver and light-emitting driver) into a single integrated driver chip, eliminating the need to package multiple separate chips together. This merger simplifies the manufacturing process by reducing assembly steps and improving manufacturing efficiency, while also reducing material costs associated with multiple chip packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration results in a compact, cost-effective, and low-power consumption device suitable for portable applications, such as smart glasses, by combining image sensing and light-emitting functions within a single chip.
Implementation Method 1
The photodiode is disposed on the second surface of the wafer substrate. The image sensing circuit is disposed in the wafer substrate and is electrically connected to the photodiode to drive the photodiode.
Data Source
AI summary
A driver chip is provided. The driver chip includes a light-emitting module and a wafer substrate. The light-emitting module has multiple pins. The wafer substrate has a first surface and a second surface. The wafer substrate includes a photodiode, an image sensing circuit, and a light-emitting driving circuit. The photodiode is disposed on the second surface of the wafer substrate. The image sensing circuit is disposed in the wafer substrate and is electrically connected to the photodiode to drive the photodiode. The light-emitting driving circuit is disposed in the wafer substrate, and is electrically connected to the multiple pins of the light-emitting module via multiple connection units on the first surface of the wafer substrate to drive the light-emitting module.