Integrated Dual-Chamber Liquid Cooling Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current computer cooling systems are complex and costly, particularly those using water cooling, which require pumps, tubing, and radiators, making them unsuitable for smaller and more affordable computing devices.
Innovation Solution
A dual-chamber heat transfer apparatus with a pump having an impeller and stator, where liquid coolant is circulated through a channel from an inlet in the upper housing to a cold plate in the lower housing, absorbing heat from a processor and then transferred to a radiator via an outlet, with an optional fan fixture for air circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water cooling systems are used to cool computer processors, then cooling efficiency is improved, but device complexity and cost increase due to requiring pumps, tubing, and radiators
Solution Approach 1:
The patent combines the pump, coolant reservoir, and cold plate into a single integrated cooling assembly. The pump is positioned within the reservoir structure, and the cold plate is integrated with the reservoir, eliminating the need for separate tubing and external components. This merging maintains effective water cooling while significantly reducing system complexity.
Solution Approach 2:
The reservoir structure serves multiple functions: it stores coolant, houses the pump mechanism, provides structural support, and integrates the cold plate for heat transfer. This multi-functionality eliminates the need for separate dedicated components for each function, reducing overall system complexity while maintaining cooling effectiveness.
2Temperature
If traditional water cooling systems with separate pumps and tubing are used, then heat transfer efficiency is improved, but manufacturing cost increases
Solution Approach 1:
By integrating the pump, reservoir, and cold plate into a single assembled unit with minimal tubing, the patent reduces the number of separate manufactured components. This integration simplifies the manufacturing process, reduces assembly steps, and lowers overall production costs while maintaining effective heat transfer through the cold plate.
Solution Approach 2:
The cooling assembly is segmented into functional modules (reservoir, pump, cold plate) that can be manufactured separately and then assembled together. This modular segmentation allows for optimized manufacturing of each component while simplifying the overall production process and reducing costs compared to traditional multi-component systems.
3Temperature
If extensive tubing and radiators are used in cooling systems, then heat dissipation is improved, but device size increases
Solution Approach 1:
The patent merges the coolant storage reservoir with the pump housing and cold plate assembly into a compact integrated unit. This eliminates the need for extensive external tubing and separate radiator components, achieving effective heat dissipation within a much smaller overall volume suitable for modern computing devices.
Solution Approach 2:
The pump is nested within the reservoir structure, and the cold plate is integrated with the reservoir assembly. This nesting arrangement maximizes space utilization and minimizes the overall volume of the cooling system while maintaining all necessary heat dissipation functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides an efficient and cost-effective cooling solution by simplifying the heat transfer process, reducing complexity, and maintaining optimal temperatures in computing devices without the need for extensive tubing or pumps.
Implementation Method 1
the liquid coolant may absorb heat absorbed by the cold plate and emanating from the proximate computer processing chip
Implementation Method 2
a pump having an impeller and a stator. The pump may receive liquid coolant through an inlet in the upper housing and circulate the liquid coolant through a second chamber reservoir
Implementation Method 3
The heated liquid coolant may be transferred from the second chamber reservoir to the radiator via an outlet offset from the inlet of the upper housing
Data Source
AI summary
A heat transfer apparatus includes a first chamber horizontally offset from a second chamber to form an upper housing and a lower housing. The upper housing may be stacked on top of and fastened to the lower housing. The heat transfer apparatus may include a heat exchange interface fixed to a bottom surface of the lower housing. The heat exchange interface may absorb heat from a proximate heat source and transfer the absorbed heat to an inner surface of the lower housing. The apparatus includes a pump including an impeller and a stator disposed therein. The lower housing may separate the impeller from the stator so that the stator is isolated from the impeller by a surrounding casing. A liquid coolant may be circulated from an inlet, over the heat exchange interface and out to an outlet to remove heat from a processer proximate to the heat exchange interface.