Integrated Dual Power Converter Package with Internal Driver IC
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Solution Overview
Problem
Conventional power supply designs, such as buck converters, require multiple half-bridge circuits and dedicated control ICs for multiple internal power supplies, leading to space-inefficient and low current and power densities due to larger physical layouts in electronic devices.
Innovation Solution
An integrated dual power converter package with internal driver ICs, where two half-bridge circuits share a single control IC, utilizing power MOSFETs or HEMTs, and a leadframe to reduce size and increase current density by integrating both half-bridge circuits within a single package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If multiple conventional power supply packages with dedicated control ICs are used, then each power supply can be independently controlled, but the physical layout becomes considerably larger and space-inefficient
Solution Approach 1:
The patent combines multiple half-bridge circuits and their control functions into a single integrated power converter package. The control IC is integrated within the same package as multiple half-bridge circuits, allowing independent control of each power supply while occupying a single compact physical footprint, thereby resolving the contradiction between independent control capability and physical layout area.
Solution Approach 2:
The integrated control IC serves multiple half-bridge circuits simultaneously, providing universal control functionality. A single control IC can control multiple power converters within the same package, enabling one component to perform multiple control functions and reducing the overall number of separate control ICs needed, thus decreasing the physical layout area while maintaining independent control capability.
2Adaptability or versatility
If multiple half-bridge circuits with dedicated control ICs are used, then each power supply operates independently, but current density and power density are undesirably low
Solution Approach 1:
By merging multiple half-bridge circuits and control functions into a single integrated package, the patent achieves higher power density. The compact integration allows multiple power conversion functions to occupy less space, concentrating the power handling capability into a smaller volume, thereby increasing power density while maintaining independent operation of each power supply through the integrated control IC.
3Device complexity
If conventional power supply packages are used, then design simplicity is maintained, but space efficiency and current capacity are compromised
Solution Approach 1:
The patent integrates multiple half-bridge circuits and control ICs into a single power converter package, combining multiple functions that would traditionally require separate components. This integration maintains design simplicity from a system level while dramatically improving space efficiency, as the integrated package occupies less board space compared to multiple separate conventional packages.
Solution Approach 2:
The integrated control IC is nested within the same package as the multiple half-bridge circuits, creating a nested structure where one component (control IC) is housed within the same physical package as other components (half-bridge circuits). This nesting approach maximizes space utilization and achieves high space efficiency while maintaining a relatively simple integrated design structure.
Data Source
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Figure 3B
AI summary
An integrated dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a first control FET, and a second control FET paddle configured to support a drain of a second control FET. The leadframe further includes a sync FET paddle configured to support a source of a first sync FET and a source of a second sync FET, and a driver integrated circuit (IC) paddle configured to support a driver IC for controlling each of the control FETs and each of the sync FETs. The leadframe may additionally include first and second switched nodes, configured for electrical connection to the first control FET and the first sync FET via a first clip, and to the second control FET and the second sync FET via a second clip, respectively.