Integrated Electrical Bracket for Compact Camera Modules

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Solution Overview

Problem

Conventional camera module packaging structures are inadequate for meeting the demands of high-pixel, ultra-thin, and compact camera modules due to issues with component size, connectivity, and manufacturing complexity, leading to increased costs and reduced production efficiency.

Innovation Solution

A camera module with an integrated electrical bracket that replaces traditional gold wire and ball mounting with a copper-based connecting system using ultrasonic welding or ACA/ACF processes, allowing for a compact structure, reduced material costs, and simplified production by eliminating the need for a separate base and enhancing connectivity between components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional gold wire and ball mounting is used for connectivity, then reliable electrical connection is achieved, but material cost increases and device size increases

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidmaterial cost and device size
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent replaces expensive gold wires and balls with copper-based connecting structures. The copper connecting piece and copper pillar provide reliable electrical connection at lower cost, embodying the principle of substituting expensive materials with cheaper alternatives that maintain functional performance

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent integrates the base and circuit board into a single integrated electrical bracket structure. This merging eliminates the need for separate base components and reduces the overall number of parts, thereby reducing device size and material usage while maintaining structural integrity and electrical connectivity

Inventive Principle:
Principle #5Merging (Combining)

2Ease of manufacture

If separate base and circuit board structure is used, then component assembly is simplified, but device size and complexity increase

Engineering Contradiction:
Improvecomponent assembly simplicityVSAvoidstructure size and component count
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent combines the base and circuit board into an integrated electrical bracket where the circuit board is mounted on the bracket body. This integration reduces the number of separate components from two (base + circuit board) to one unified structure, simplifying assembly while reducing overall device size and complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated electrical bracket serves multiple functions simultaneously: it provides mechanical support (base function), electrical connectivity (circuit board function), and structural integration. This multi-functionality eliminates the need for separate components while maintaining all necessary functions

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Measurement precision

If high-pixel chips are used to meet imaging requirements, then image quality improves, but chip area and passive component count increase

Engineering Contradiction:
Improveimaging resolutionVSAvoidchip area and module size
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent transitions from planar arrangement of components to a three-dimensional integrated structure. The copper pillar vertical connection and integrated electrical bracket utilize the vertical dimension to reduce horizontal footprint, allowing high-pixel chips to be accommodated without proportionally increasing overall module area

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Reliability

If conventional welding process is used after assembly, then electrical connection is achieved, but manufacturing complexity and quality control difficulty increase

Engineering Contradiction:
Improveelectrical connectionVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent pre-integrates the circuit board with the electrical bracket during the bracket fabrication process, rather than performing welding after complete assembly. This preliminary integration of electrical connections simplifies the manufacturing process by eliminating post-assembly welding steps and reduces quality control complexity

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in a more compact, cost-effective, and efficient camera module production with improved connectivity and reduced material usage, addressing the challenges of size and complexity in conventional packaging structures.

Implementation Method 1

replaces traditional gold wire and ball mounting with a copper-based connecting system using ultrasonic welding or ACA/ACF processes

Methodology Applied
Scientific EffectUltrasonic welding: Welding

Data Source

PatentEP3386182B1Image capturing module and electrical support thereof
Publication Date: 2024.11.27 NINGBO SUNNY OPOTECH CO LTD
  • EP3386182B1 patent drawingFigure 1
  • EP3386182B1 patent drawingFigure 2
  • EP3386182B1 patent drawingFigure 3~4

AI summary

The present disclosure provides a camera module and an electrical bracket thereof. The electrical bracket is provided with a clear aperture. The electrical bracket not only has the functions of a conventional circuit board (conduction of the electrical signal of an electronic device such as a chip and a motor), but also has the effects of a conventional base to support an optical filter and serve as a motor base bracket.