Integrated Electrode Assembly for Precise Low-Scrap Stamping
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Solution Overview
Problem
Conventional electrode assemblies require multiple fabrication steps, are prone to misalignment and damage during assembly, and result in significant scrap material, leading to increased production costs.
Innovation Solution
A novel electrode assembly design featuring a substrate with integrated electrode and wiring connection structures, secured by tabs and openings, allowing for efficient assembly and reduced material waste through a stamping process that minimizes misalignment and damage, and includes a thicker substrate to withstand mechanical processes without compromising flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electrode assemblies are assembled using multiple separate components and molds, then the assembly process is flexible, but misalignment and damage occur during assembly leading to lower manufacturing precision
Solution Approach 1:
The patent combines multiple separate components (electrode, wiring connection structure, and substrate) into a single integrated electrode assembly that is formed in one stamping process. This eliminates the need for multiple assembly steps and molds, thereby preventing misalignment and damage while reducing the overall number of fabrication steps through integration of functions.
Solution Approach 2:
The integrated electrode assembly is designed with distinct functional segments (electrode portion, wiring connection structure with tabs and openings) that are formed simultaneously as a single piece. This segmentation within integration allows each component to maintain its specific function while eliminating alignment issues between separate parts.
2Loss of substance
If conventional electrode assemblies are fabricated with multiple molds and steps, then component flexibility is maintained, but significant scrap material is produced leading to higher production costs
Solution Approach 1:
The patent merges multiple components into a single integrated structure formed by one stamping process, which dramatically reduces scrap material by eliminating the need for separate fabrication of electrode, wiring connection structure, and substrate. The integrated design allows for optimized material usage and reduced production costs while maintaining manufacturing simplicity through a single-forming process.
3Strength
If the substrate is made thicker to withstand mechanical processes, then structural strength is improved, but flexibility may be compromised
Solution Approach 1:
The substrate is designed with non-uniform thickness, being thicker in regions that require structural strength to withstand mechanical processes during assembly and use, while maintaining thinner sections where flexibility is needed. This local variation in thickness allows the substrate to simultaneously achieve both strength and flexibility requirements through optimized geometric design.
Data Source
AI summary
An electrode assembly includes a substrate, a plurality of electrodes, and a wiring assembly. The substrate includes an elongate body extending from a first end to a second end in a first direction and a plurality of electrode connection structures connected with the elongate body. Each electrode connection structure defines a first coupling end, a second coupling end, and a first opening positioned between the first coupling end and the second coupling end. The electrodes are positioned within the plurality of electrode connection structures. A portion of each electrode extends through the first opening of the respective electrode connection structure. The wiring assembly extends along the substrate and forms an electrical connection with each of the plurality of the electrodes.