Integrated Electromagnetic Antenna Segmented Substrates
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Solution Overview
Problem
The integration of electrical connections and electromagnetic antennas in electronic devices requires complex production of multilayer dielectric substrates and precise adjustment, making the process difficult and inefficient.
Innovation Solution
The electronic device is composed of two independent units: one with an integrated network of electrical connections and an IC chip, and another with an electromagnetic antenna, where the antenna's exciter element is on the substrate and the resonator element is on a separate dielectric support, allowing for simplified integration and alignment through independent manufacturing and mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the electromagnetic antenna and network of electrical connections are integrated into the same dielectric support substrate, then the antenna can be integrated into the electronic device, but the production complexity increases due to the large number of stacked dielectric layers required
Solution Approach 1:
The patent divides the antenna system into two separate parts: an exciter element integrated into the first dielectric support substrate with the electrical connections, and a resonator element mounted on a second dielectric support substrate. This segmentation allows each part to be manufactured independently with fewer layers, reducing production complexity while maintaining functional integration.
2Ease of manufacture
If the electromagnetic antenna is integrated into the dielectric support substrate with the network of electrical connections, then the antenna is integrated into the device, but the positioning and dimensioning adjustment becomes difficult
Solution Approach 1:
By separating the exciter element (on the first substrate) from the resonator element (on the second substrate), the patent enables independent positioning and dimensioning adjustment of each element. This allows for easier manufacturing precision control as each component can be optimized and adjusted separately before final assembly.
Solution Approach 2:
The patent introduces a second dielectric support substrate as an intermediary carrier for the resonator element. This intermediary structure provides a flexible mounting platform that facilitates precise positioning and dimensioning adjustment of the resonator relative to the exciter element, while maintaining electrical isolation and mechanical stability.
Data Source
AI summary
A first independent unit includes a support substrate with an integrated network of electrical connections. An electronic integrated circuit chip is mounted above a front face of the support substrate. A second independent unit includes a dielectric support. The second independent unit is stacked above the first independent unit on a side of the front face of the first independent unit. An electromagnetic antenna includes an exciter element and a resonator element. The exciter element provided at the support substrate. The resonator element is provided at the dielectric support.