Integrated Electronic Compass Using Lorentz Force Sensing
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Solution Overview
Problem
Conventional MEMS technologies face challenges in creating sensitive structures for measuring magnetic fields, particularly for electronic compassing, and struggle to integrate MEMS devices for X and Y axes implementation while maintaining sensitivity for Z-axis applications.
Innovation Solution
The development of a method to fabricate an electronic compass integrated with CMOS integrated circuits and MEMS devices using a foundry compatible process, employing a Lorentz force configuration with movable structures and capacitance sensing to measure magnetic fields, allowing for high sensitivity and compatibility with conventional technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional MEMS technologies are used to create sensitive structures for measuring magnetic fields, then device complexity is reduced, but measurement precision deteriorates
Solution Approach 1:
The device is divided into two separate substrates: a first substrate containing CMOS integrated circuits and a second substrate containing MEMS devices. This segmentation allows each substrate to be optimized independently for its specific function, enabling high measurement precision for magnetic fields while managing device complexity through modular architecture.
Solution Approach 2:
The patent implements a stacked configuration where the first substrate with CMOS circuits is positioned above the second substrate with MEMS devices, forming a nested three-dimensional integration structure. This nesting approach enables sophisticated magnetic field measurement capabilities while maintaining compact form factor and manageable complexity.
2Adaptability or versatility
If MEMS devices are integrated for X and Y axes implementation, then adaptability is improved, but measurement precision deteriorates due to reduced sensitivity for Z-axis applications
Solution Approach 1:
The patent applies different structural configurations to different substrates: the first substrate is optimized for X and Y axis measurements with appropriate MEMS structures, while the second substrate is specifically optimized for Z-axis measurements. This local quality approach ensures that each axis measurement location has the optimal structure for its intended function, maintaining high Z-axis sensitivity while providing multi-axis adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances device yields, reduces parasitic resistances and capacitances, and achieves high accuracy in magnetic field measurement, enabling effective integration of MEMS devices across multiple axes without substantial modifications to existing equipment or processes.
Implementation Method 1
employing a Lorentz force configuration with movable structures and capacitance sensing to measure magnetic fields
Implementation Method 2
employing a Lorentz force configuration with movable structures and capacitance sensing to measure magnetic fields
Data Source
AI summary
A method for fabricating an integrated electronic compass and circuit system. The fabrication method begins with providing a semiconductor substrate comprising a surface region. One or more CMOS integrated circuits are then formed on one or more portions of the semiconductor substrate. Once the CMOS circuits are formed, a thickness of dielectric material is formed overlying the one or more CMOS integrated circuits. A substrate is then joined overlying the thickness of the dielectric material. Once joined, the substrate is thinned to a predetermined thickness. Following the thinning process, an electric compass device is formed within one or more regions of the predetermined thickness of the substrate. Other mechanical devices or MEMS devices can also be formed within one or more regions of the thinned substrate.