Integrated Electronic Structural Member Design

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Solution Overview

Problem

Current designs for mechanical structures that house and support electronic components often result in inefficient space utilization, increased weight, and higher costs due to separate design and assembly of mechanical and electronic components.

Innovation Solution

Integration of mechanical structural and electronics functions during the design and fabrication stage, where multifunctional structures with embedded electronics are created using materials like metals, plastics, or composite materials, forming monolithic units that combine structural support with electrical functionality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If mechanical structures and electronic components are designed and fabricated separately, then each component can be optimized independently, but the overall space utilization becomes inefficient and weight increases

Engineering Contradiction:
Improvecomponent optimizationVSAvoidspace utilization
Core Design Contradiction:
Manufacturing precisionVSVolume of moving object

Solution Approach 1:

The patent merges mechanical structural components with electronic components into integrated assemblies where electronic components are mounted directly onto structural elements such as antenna supports and radar housing, eliminating separate component housings and reducing overall volume

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Structural components are designed to serve multiple functions simultaneously - providing mechanical support, housing for electronics, and in some cases antenna functionality, thereby reducing the number of separate components needed and optimizing space utilization

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If mechanical structures and electronic components are designed and fabricated separately, then manufacturing is simpler, but assembly complexity increases and requires more touch labor

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidassembly complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

By combining mechanical and electronic components into integrated assemblies during the design phase, the patent reduces the number of separate assembly operations required, as components are pre-positioned and secured to structural elements rather than requiring separate attachment steps

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Electronic components are pre-mounted and secured to structural elements during the structural component fabrication process itself, rather than requiring separate assembly operations later, thereby reducing overall assembly complexity

Inventive Principle:
Principle #10Preliminary action

3Reliability

If separate component housings are used for electronic components, then each component is protected, but the overall weight increases

Engineering Contradiction:
Improvecomponent protectionVSAvoidoverall weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

Structural components such as antenna supports and radar housing serve dual purposes by providing both mechanical structural support and protective enclosures for electronic components, eliminating the need for separate component housings and reducing overall weight

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS8988172B1Integrated electronic structure
Publication Date: 2015.03.24 LOCKHEED MARTIN CORP
  • US8988172B1 patent drawing
  • US8988172B1 patent drawing
  • US8988172B1 patent drawing

AI summary

A multifunction electronics member combining structural and electronics functions includes in one embodiment an elongate longitudinally-extending structural body configured to support a structural load and including a first support base, a stiffening projection, and a first electrical circuit supported by the first support base. The circuit preferably is embedded between the first circuit base and a cover to form an electrically-active, or in some embodiments passive, structural member.