Integrated EMI Shield Structure for Compact Semiconductor Packages
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Solution Overview
Problem
Existing semiconductor packages face challenges in effectively integrating EMI shielding within a compact footprint, leading to reliability issues due to the close proximity of electronic components and the limitations of traditional EMI shielding methods that increase package size.
Innovation Solution
A semiconductor package design that includes a package substrate with a die attach pad and package pads, where a die is electrically coupled to the pads, and an EMI shield structure is attached over the die, electrically coupled to ground, using conductive materials like copper or silver alloys to form a planar member and leg members creating an L-shaped or U-shaped profile for effective shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal enclosure is placed over individual modules to perform EMI shielding, then EMI shielding effectiveness is improved, but package size increases
Solution Approach 1:
The patent combines multiple EMI shield structures into a single integrated shield that covers multiple modules simultaneously. The integrated EMI shield is formed as one continuous structure that provides shielding for several individual modules, eliminating the need for separate metal enclosures for each module. This merging approach maintains EMI shielding effectiveness while reducing the overall package size and footprint.
Solution Approach 2:
The integrated EMI shield structure serves multiple functions: it provides EMI shielding for multiple modules simultaneously, acts as a structural support element, and can be configured to accommodate different module arrangements. This multi-functional design eliminates the need for separate shielding components for each module, thereby reducing package size while maintaining shielding effectiveness.
2Area of stationary object
If multiple electronic components are packed closely together to achieve compactness, then product compactness is improved, but electromagnetic interference increases
Solution Approach 1:
The integrated EMI shield structure provides localized shielding zones for each individual module within the compact package. The shield is configured with specific geometric features and grounding arrangements that create electromagnetic field containment zones around each module, allowing close packing of components while preventing electromagnetic interference between them through localized field management.
3Reliability
If traditional EMI shielding methods are used, then EMI protection is improved, but device complexity increases
Solution Approach 1:
The patent integrates multiple shielding functions into a single EMI shield structure that protects multiple modules simultaneously. This unified approach reduces the number of separate shielding components, assembly steps, and grounding connections required, thereby simplifying the overall device complexity while maintaining comprehensive EMI protection across all modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design provides reliable EMI shielding within the package footprint, enhancing the compactness and performance of semiconductor packages by effectively reflecting or absorbing electromagnetic interference while minimizing internal EM field leakage.
Implementation Method 1
an electromagnetic interference (EMI) shield structure attached to the package substrate. The EMI shield structure is disposed over the die on the DAP, wherein the EMI shield structure is electrically coupled to ground
Data Source
AI summary
The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. An integrated shielding structure may be disposed in between the package substrate and the encapsulant to shield internal and/or external EMI. For example, a top surface of the integrated shield structure is exposed.