Integrated EMI Shielding Structure for Simpler Semiconductor Packaging
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Solution Overview
Problem
Existing semiconductor package structures with EMI shielding functions have complex manufacturing processes, including the need for separate assembly of metal covers or wire bonding, which complicates the production procedures.
Innovation Solution
A semiconductor package structure that integrates a package carrier, electronic components, a packaging layer, a support component, and a shielding layer, where the support component and shielding layer form a shielding space to cover the electronic components, simplifying the manufacturing process by integrating EMI shielding during packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal cover is used to shield electromagnetic interference, then the EMI shielding effect is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent merges the EMI shielding function with the packaging layer by integrating a conductive shielding layer into the packaging structure. The shielding layer is formed simultaneously with the packaging layer through the same manufacturing process, eliminating the need for separate metal cover assembly. This integration maintains effective EMI shielding while significantly simplifying the manufacturing process by reducing the number of discrete components and assembly steps.
Solution Approach 2:
The packaging layer is designed to serve multiple functions: it provides mechanical protection, electrical insulation, and EMI shielding. By incorporating the conductive shielding layer within the packaging structure, the same component (packaging layer) performs both protective and shielding roles, eliminating the need for separate dedicated shielding components and simplifying the overall manufacturing process.
2Object-affected harmful factors
If wire bonding is used to shield electromagnetic interference, then the EMI shielding effect is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent combines the EMI shielding function with the packaging layer formation process. The conductive shielding layer is integrated into the packaging layer and formed simultaneously using the same manufacturing steps, eliminating the need for separate wire bonding operations. This integration maintains effective EMI shielding while significantly reducing manufacturing complexity by consolidating multiple functions into a single process.
3Ease of manufacture
If EMI shielding is integrated during packaging, then the manufacturing process is simplified, but the shielding effectiveness may be compromised
Solution Approach 1:
The patent successfully merges the shielding function with the packaging layer by incorporating a conductive shielding layer that maintains effective EMI protection. The shielding layer is formed with sufficient thickness and continuity to provide adequate shielding effectiveness while being integrated into the packaging structure through the same manufacturing process, thus achieving both manufacturing simplicity and shielding effectiveness.
Solution Approach 2:
The conductive shielding layer is strategically positioned and configured within the packaging layer to provide optimal EMI shielding at critical locations. The shielding layer can be patterned or distributed according to the specific EMI protection needs of different regions, ensuring adequate shielding effectiveness while maintaining manufacturing simplicity through integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated EMI shielding component simplifies the manufacturing process of semiconductor package structures by forming the shielding structure simultaneously during packaging, reducing complexity and improving workability.
Implementation Method 1
the shielding layer is disposed on the packaging layer and the support component... The patterned metal layer is electrically connected to the support component, and the shielding range of the patterned metal layer covers at least the electronic component and the support component
Data Source
AI summary
The invention discloses a semiconductor package structure including a package carrier, at least one electronic component, a packaging layer, a support component and a shielding layer. The electronic component is disposed on a first surface of the package carrier. The packaging layer is disposed on the first surface and covers the electronic component. The support component is embedded in the packaging layer to surround the electronic component. An end surface of the support component is electrically connected to a build-up circuit and electrically grounded. A patterned metal layer of the shielding layer is electrically connected to the support component. The shielding range of the patterned metal layer covers at least electronic component. A shielding space, which covers the electronic component, is formed by the support component and the shielding layer. In addition, a semiconductor EMI shielding component and a method of making a semiconductor package structure are also disclosed.