Integrated ESD Diode Structure for Solid-State Emitters

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Solution Overview

Problem

Conventional approaches for mitigating electrostatic discharge (ESD) in solid-state lighting (SSL) devices, such as connecting a protection diode, require additional connection steps and can compromise the electrical integrity of the SSL device, necessitating a more reliable and cost-effective solution.

Innovation Solution

The integration of an electrostatic discharge device directly onto a solid-state emitter, using materials from the same epitaxial substrate, forms a parallel diode structure that provides protection against ESD without separate attachment or additional connection steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protection diode is connected to the SSL device to mitigate ESD effects, then the device gains ESD protection capability, but additional connection steps are required and electrical integrity is compromised

Engineering Contradiction:
ImproveESD protection capabilityVSAvoidconnection steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the ESD protection function with the SSL device structure by integrating a protection diode directly into the device. The protection diode is formed using the same epitaxial substrate and sharing common contact structures, eliminating the need for separate attachment and additional connection steps while maintaining ESD protection capability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The epitaxial substrate serves multiple functions: it acts as both the foundation for the SSL device and as the substrate for the protection diode. The common contact structures serve dual purposes for both the SSL device operation and ESD protection, reducing overall device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If a protection diode is connected to the SSL device to mitigate ESD effects, then the device gains ESD protection capability, but the electrical integrity of the structure is compromised

Engineering Contradiction:
ImproveESD protection capabilityVSAvoidelectrical integrity
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

By integrating the protection diode into the SSL device structure with shared contact structures and common epitaxial substrate, the patent eliminates separate connections that could compromise electrical integrity. The unified structure ensures consistent electrical performance while providing ESD protection

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If conventional ESD protection approaches are used with separate protection diodes, then ESD protection is provided, but material costs and manufacturing complexity increase

Engineering Contradiction:
ImproveESD protectionVSAvoidmanufacturability
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The protection diode and SSL device are manufactured together in an integrated structure using the same epitaxial substrate and fabrication processes. This eliminates separate manufacturing steps, reduces material waste, and simplifies the overall manufacturing process while ensuring ESD protection

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent uses the same epitaxial substrate material for both the SSL device and the protection diode, ensuring material homogeneity. This approach simplifies manufacturing by eliminating the need for different materials and reduces overall material costs

Inventive Principle:
Principle #33Homogeneity

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This integrated approach enhances the reliability and manufacturability of SSL devices by reducing material costs and eliminating the need for additional connection steps, while effectively protecting the devices from ESD damage.

Implementation Method 1

an electrostatic discharge device 250 formed on a solid state emitter 202

Methodology Applied
Scientific EffectElectrostatic Discharge: Electrostatic Discharge

Data Source

PatentUS20250031510A1Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods
Publication Date: 2025.01.23 MICRON TECHNOLOGY INC
  • US20250031510A1 patent drawing
  • US20250031510A1 patent drawing
  • US20250031510A1 patent drawing

AI summary

Solid state transducer devices having integrated electrostatic discharge protection and associated systems and methods are disclosed herein. In one embodiment, a solid state transducer device includes a solid state emitter, and an electrostatic discharge device carried by the solid state emitter. In some embodiments, the electrostatic discharge device and the solid state emitter share a common first contact and a common second contact. In further embodiments, the solid state lighting device and the electrostatic discharge device share a common epitaxial substrate. In still further embodiments, the electrostatic discharge device is positioned between the solid state lighting device and a support substrate.