Integrated Evaporator in Electronic Device Package
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Solution Overview
Problem
Current electronic device packaging designs suffer from sub-optimal thermal interface efficiency between the package and thermal management systems, leading to increased junction temperatures and reduced performance due to undesirable thermal resistance and manufacturing limitations.
Innovation Solution
The design of an electronic device package that integrates a housing with an evaporator portion of a heat pipe, allowing for a hermetically sealed connection to a secondary portion of the thermal management system, utilizing wicking material for continuous fluid transfer and reducing the number of thermal interfaces, enabling efficient heat dissipation using standard manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional packaging interfaces to heat pipe by attaching evaporator to outside of packaging, then manufacturing cost is reduced and standard packaging processes can be used, but thermal resistance increases and thermal transfer efficiency deteriorates
Solution Approach 1:
The patent merges the packaging housing with the evaporator into a single integrated component. The housing is formed with an integrated evaporator portion that directly contacts the light-emitting elements, eliminating the need for separate attachment of the evaporator to the packaging. This integration reduces thermal resistance at interfaces while maintaining compatibility with standard manufacturing processes.
2Adaptability or versatility
If multiple thermal interfaces are used between light-emitting elements and heat pipe, then manufacturing flexibility is improved, but thermal resistance increases and heat transfer capability deteriorates
Solution Approach 1:
The patent combines multiple thermal interface functions into a single integrated evaporator structure. The evaporator portion directly contacts the light-emitting elements, and the housing provides structural support and thermal conduction pathways, reducing the number of separate thermal interfaces while maintaining manufacturing flexibility.
3Device complexity
If evaporator is separately attached to packaging, then manufacturing complexity is reduced, but thermal contact area is limited and junction temperature increases
Solution Approach 1:
The patent integrates the evaporator within the housing structure, allowing the evaporator surface to extend over a larger area and provide enhanced thermal contact with the light-emitting elements. This integration increases the effective thermal contact area without significantly increasing manufacturing complexity, as the evaporator is formed as part of the housing during standard packaging processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal transfer capabilities, reduces thermal resistance, and extends the lifespan of electronic devices by maintaining efficient cooling under operating conditions while being compatible with standard manufacturing techniques.
Implementation Method 1
utilizing wicking material for continuous fluid transfer
Implementation Method 2
evaporator portion of a heat pipe
Implementation Method 3
heat pipe, thermosyphons, liquid coolers and other techniques, for example, are used in power electronics or digital processors to spread the heat load over a large area
Implementation Method 4
heat pipes, thermosyphons, liquid coolers and other techniques, for example, are used in power electronics or digital processors to spread the heat load over a large area for dissipation of this heat to the environment
Implementation Method 5
dissipation of this heat to the environment
Data Source
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AI summary
The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention comprises a housing that is specifically designed to couple with an evaporator portion of a thermal management system, for example a heat pipe. One or more electronic devices are mounted in thermal contact with the evaporator portion of the thermal management system. Upon completion of the fabrication of the package using standard techniques, the evaporator portion of the electronic device package is operatively coupled with a secondary portion of the thermal management system. In this manner the electronic device package can be fabricated to incorporate a desired thermal management system, while being fabricated using standard package fabrication processes and machinery.