Integrated Fence Dike for Epoxy Containment in Semiconductor Equipment
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Solution Overview
Problem
Conventional dikes for semiconductor-manufacturing equipment are time-consuming and costly to install, prone to epoxy leakage and damage, and inefficient in contaminant collection due to complex corner designs and high viscosity epoxy issues, with epoxy adhering to porous floors, making removal difficult.
Innovation Solution
A dike formed by engaging straight and corner blocks with predetermined heights to create a fence, injecting molten epoxy into the space, and solidifying it, with an optional inclined epoxy block for contaminant discharge and a TEFLON sheet for easy removal, facilitating installation, reducing leakage, and enhancing contaminant collection efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If separate outer wall and inner wall components are used with coupling protrusions to reinforce the fence structure, then the structural strength is improved, but the manufacturing complexity and installation time increase
Solution Approach 1:
The patent merges the outer wall and inner wall into a single integrated fence component. The fence is formed as one piece with thickness variations - thicker at corners for strength and thinner at straight sections for ease of installation. This eliminates coupling protrusions and separate assembly steps while maintaining structural integrity through the integrated design.
Solution Approach 2:
The fence is segmented into corner sections with greater thickness for strength and straight sections with lesser thickness for ease of installation. This segmentation allows each part to be optimized for its specific function while being manufactured as an integrated structure.
2Stability of the object's composition
If molten epoxy is injected into the gap between outer and inner walls, then the fence rigidity is improved, but epoxy leakage occurs at corner gaps
Solution Approach 1:
By merging the walls into a single integrated fence structure, the patent eliminates the gaps between outer and inner walls that cause epoxy leakage. The epoxy is applied to the floor within the fence perimeter rather than being injected into wall gaps, preventing leakage while still providing rigidity.
3Productivity
If perpendicular corner joints are used in the fence design, then the contaminant collection efficiency is improved, but epoxy leakage through corner gaps occurs
Solution Approach 1:
The integrated fence design merges corner and straight sections into a single component, eliminating the joint gaps that cause epoxy leakage. The perpendicular corner geometry is maintained for effective contaminant collection while the integrated construction prevents epoxy from leaking through corner joints.
4Strength
If high viscosity molten epoxy is used to fill the fence gap, then the structural bonding is improved, but complete injection into the gap becomes difficult
Solution Approach 1:
By eliminating the gap between walls through the integrated fence design, the patent removes the epoxy injection step entirely. Epoxy is applied to the floor surface within the fence perimeter, where it can spread completely without being hindered by high viscosity or narrow gaps.
5Productivity
If epoxy is applied directly to the porous floor, then the contaminant collection is improved, but epoxy adheres to the floor making removal difficult
Solution Approach 1:
The patent introduces a release agent or barrier layer as an intermediary between the epoxy and the porous floor. This allows the epoxy to be applied directly to the floor for effective contaminant collection while preventing permanent adhesion, enabling easy removal when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies and accelerates dike installation, increases fence rigidity, prevents epoxy leakage, and facilitates contaminant collection and removal, improving operational efficiency and reducing reconstruction needs.
Implementation Method 1
an epoxy in a molten state is injected to a predetermined height in the space within the fence and solidified
Data Source
AI summary
Disclosed is a dike for semiconductor/LCD manufacturing and processing equipment, in which a plurality of straight blocks and a plurality of corner blocks, having a predetermined height, are engaged to form a polygonal-shaped fence having a predetermined area, and molten epoxy is injected to a predetermined height in the space within the fence and solidified.