Integrated Fiber Array Unit with Embedded Passive Optical Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical signaling and processing systems require additional passive optical components outside of the fiber array unit (FAU) structure, leading to increased package size and risk of damage to these components during assembly.
Innovation Solution
The integrated FAU structure combines a FAU holding optical fibers with a light guide structure that includes passive optical components such as reflectors, lenses, waveguides, and beam splitters, eliminating the need for external components and enhancing structural stability with a carrier board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional passive optical components are placed outside the FAU structure, then optical functionality is achieved, but package size increases and risk of damage during assembly increases
Solution Approach 1:
The patent merges the FAU structure with passive optical components (reflectors, lenses, waveguides, beam splitters) into a single integrated unit. This integration eliminates the need for separate external components, thereby reducing package size and removing the risk of damage during assembly that would occur with separate components. The integrated structure maintains all necessary optical functionalities while consolidating multiple elements into one protective unit.
2Area of stationary object
If passive optical components are integrated within the FAU structure, then package size is reduced and reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs a nested structure where passive optical components are embedded within the FAU structure. Reflectors are positioned within recesses in the FAU, lenses are integrated into the FAU body, waveguides are embedded within the FAU structure, and beam splitters are incorporated into the FAU. This nesting approach allows multiple components to be housed within a single unified structure, reducing overall package size while managing integration complexity through hierarchical organization.
3Ease of manufacture
If passive optical components are exposed outside the FAU structure, then assembly is simpler, but protection against damage is reduced
Solution Approach 1:
By merging the FAU structure with passive optical components, the patent creates a unified integrated unit where components are inherently protected by the FAU structure itself. The FAU acts as a protective housing that encloses and shields the passive optical components during assembly and operation, eliminating the need for separate protective measures while maintaining assembly feasibility through the integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the package size of semiconductor packages by integrating passive optical components within the FAU structure, improves product yield and reliability by protecting these components, and enhances structural stability through mechanical support.
Implementation Method 1
After the optical glue has been dispensed between the FAU and the photonic package, it can be cured, e.g., by ultraviolet (UV) curing.
Data Source
AI summary
A fiber array unit (FAU) structure and the method for forming the same are provided. The FAU structure includes a FAU, a passive optical component structure, and a carrier board. The FAU includes a fiber holder holding optical fibers. The passive optical component structure includes a reflective layer and a lens layer. The reflective layer includes reflectors adjacent to the optical fibers. The lens layer includes silicon lenses adjacent to the reflectors. The carrier board is configured to support the FAU and the passive optical component structure. The FAU and the passive optical component structure are adjacent to each other. The lens layer is located between the reflective layer and the carrier board.