Integrated Filter Circuit for Semiconductor Heating
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Solution Overview
Problem
Existing semiconductor processing apparatuses face challenges in achieving uniformity during silicon etching processes due to single or dual-temperature-zone electrostatic chucks, which fail to compensate for temperature differences across large wafers, leading to inefficiencies in process uniformity, especially in smaller line-width processes.
Innovation Solution
A filter circuit and heating circuit design that incorporates an integrated component with transformer and inductor functions, reducing the number of components and volume, allowing for separate temperature control of different zones on the chuck, thereby enhancing process uniformity and miniaturizing the apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-temperature-zone electrostatic chuck is used, then the device complexity is low, but the process uniformity deteriorates due to inability to compensate temperature differences across large wafers
Solution Approach 1:
The electrostatic chuck is divided into multiple independent temperature zones (dual-temperature-zone or multi-temperature-zone), allowing separate temperature control for different regions of the wafer. This segmentation enables compensation for temperature differences across large wafers, improving process uniformity while maintaining manageable device complexity through modular heating elements and control circuits.
2Reliability
If traditional separate transformer and inductor components are used in the heating circuit, then the filtering performance is adequate, but the device volume increases and miniaturization is hindered
Solution Approach 1:
The transformer and inductor functions are merged into a single integrated component within the heating circuit. This integration maintains the necessary filtering performance for the RF power source while significantly reducing the overall volume of the filter circuit, enabling miniaturization of the semiconductor processing apparatus without sacrificing reliability.
Solution Approach 2:
The integrated component performs multiple functions simultaneously - both voltage transformation and current filtering - that were previously required separate components. This multi-functionality reduces the number of parts needed in the heating circuit, decreasing device volume and simplifying the overall system architecture while maintaining adequate filtering performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the volume and cost of the filter circuit, achieves miniaturization, and improves temperature control, ensuring better process uniformity across the wafer by integrating transformer and inductor functions in a compact design, addressing the limitations of existing dual-temperature-zone electrostatic chucks.
Implementation Method 1
The transformer function member includes a first magnetic core in a closed loop, and the first magnetic core includes a first side and a second side opposite to each other, where a primary coil is wound on the first side, and a secondary coil is wound on the second side
Implementation Method 2
The inductor function member includes two second magnetic cores, which are respectively connected to terminals of the first side and form a non-closed open ring with the first side. Inductive coils are wound on the two secondary coils
Data Source
AI summary
A filter circuit is connected between a heating source and a load for filtering the load, and includes an inductor branch and a capacitor branch connected in parallel. The inductor branch includes a one-piece structured integrated component, and the integrated component is configured with a transformer function member and an inductor function member. The inductor function member is connected in series between the heating source and the transformer function member for filtering the load. The transformer function member is connected in parallel with the load for transmitting a heating electric signal output by the heating source to the load.