Integrated-Fin Heat Spreader for Low-Resistance Coolant Cooling
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Solution Overview
Problem
Conventional autonomous vehicle computing devices face thermal performance issues due to high thermal resistance caused by multiple layers between heat generating components and heat sinks, which hinders efficient heat dissipation.
Innovation Solution
A heat spreader with externally integrated fins is introduced, which eliminates the need for thermal interface material layers by directly immersing the fins in a coolant, enhancing convective cooling and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers (thermal interface material layers) are placed between heat generating component and heat sink, then thermal resistance increases, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent removes thermal interface material layers from the heat dissipation path by directly integrating fins onto the heat spreader bottom surface, eliminating unnecessary intermediate layers that contribute to thermal resistance
Solution Approach 2:
The patent merges the heat spreader and heat sink into a single integrated component, with fins directly formed on the heat spreader bottom surface, eliminating the need for separate thermal interface materials and reducing thermal resistance
2Ease of manufacture
If thermal interface material layers are used between heat spreader and heat sink, then assembly is simplified, but thermal resistance increases
Solution Approach 1:
The heat spreader and heat sink are merged into one integrated component with fins directly formed on the heat spreader, eliminating the need for separate thermal interface materials while maintaining assembly simplicity
Solution Approach 2:
The heat spreader structure itself provides the heat dissipation function through integrated fins, eliminating the need for additional thermal interface materials and simplifying the overall assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat spreader provides improved thermal performance by directly dissipating heat from heat generating components to a coolant, reducing material layers and enhancing cooling efficiency compared to conventional designs.
Implementation Method 1
the top surface of the heat spreader is thermally conductive... the heat from the heat generating component flows from the top surface to the externally integrated fins on the bottom surface
Implementation Method 2
enhancing convective cooling... the heat spreader is configured to dissipate the heat from the heat generating component such that the heat from the heat generating component flows from the top surface to the externally integrated fins on the bottom surface
Data Source
AI summary
Various technologies described herein pertain to a heat spreader for an autonomous vehicle computing device. The heat spreader includes a top surface, a bottom surface, and a side surface. The top surface of the heat spreader is thermally conductive. The top surface of the heat spreader includes a section that is sized and shaped to align with a heat generating component (e.g., on a printed circuit board assembly). The top surface of the heat spreader is configured to receive heat from the heat generating component. The bottom surface of the heat spreader includes externally integrated fins. The heat spreader is configured to dissipate the heat from the heat generating component such that the heat from the heat generating component flows from the top surface to the externally integrated fins on the bottom surface.