Integrated Fin Pack for Thermal and EM Shielding in Consumer Electronics
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Solution Overview
Problem
Modern computing devices face challenges in managing heat and electromagnetic interference (EMI) from increasingly powerful components, requiring larger housings and inefficient thermal management systems that compromise on size and weight.
Innovation Solution
An integrated fin pack that combines thermal management and EM shielding, featuring a plurality of channels and fins to dissipate heat while attenuating EM radiation, designed to function similarly to a Faraday cage, allowing for improved airflow and reduced component size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional thermal management and EM shielding are used separately, then EM shielding performance is improved, but device size and weight increase
Solution Approach 1:
The patent combines thermal management and EM shielding functions into a single integrated fin pack structure. The fin pack uses thermally conductive material with embedded conductive traces that provide both heat dissipation pathways and EM shielding capabilities, eliminating the need for separate shielding components and reducing overall device weight.
Solution Approach 2:
The fin pack structure serves multiple functions simultaneously: it acts as a heat sink for thermal management, provides EM shielding through embedded conductive traces, and maintains structural integrity. This multi-functional design allows a single component to address both thermal and electromagnetic challenges without requiring additional dedicated components.
2Object-affected harmful factors
If larger housings are used to move components further apart, then EM interference is reduced, but device compactness deteriorates
Solution Approach 1:
The integrated fin pack acts as an intermediary structure between heat-generating components and the antenna. The conductive traces within the fin pack create electromagnetic barriers that shield the antenna from interference, while the fin structure provides thermal pathways. This intermediary approach enables effective EM shielding without increasing the distance between components or enlarging the housing.
3Power
If more powerful components are used, then computing power is improved, but heat generation increases
Solution Approach 1:
The fin pack structure modifies thermal parameters by providing increased surface area for heat dissipation and optimized thermal pathways through the conductive material. The embedded conductive traces create additional heat transfer channels, improving the overall thermal conductivity and enabling more powerful components to operate at lower temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated fin pack enhances both thermal management and EM attenuation performance, reducing processor temperature by approximately 5% and ambient temperature by 1.4°C, while maintaining a compact design.
Implementation Method 1
The fin pack is in thermal communication with the heat source to dissipate heat from the heat source
Implementation Method 2
The plurality of channels extends from a first end toward a second end... to dissipate heat
Implementation Method 3
The fin pack is adjacent the antenna without any added electromagnetic shielding between the fin pack and the antenna... designed to function similarly to a Faraday cage... attenuating EM radiation
Data Source
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Figure 3
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AI summary
A thermal management device with electromagnetic (EM) shielding includes a fin pack with a plurality of channels. The fin pack has an upper and lower surface. The fin pack has a pack length, pack height, and pack width. The fin pack has fins are oriented connecting the upper surface to the lower surface. The plurality of channels extends from a first end toward a second end. A first channel of the plurality of channels is adjacent the upper surface, and a second channel of the plurality of channels is adjacent the lower surface.