Integrated Enclosure for Ultrasonic Flowmeter Cost Reduction

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Solution Overview

Problem

Existing ultrasonic flowmeters require two separate enclosures for electronics, which complicates fabrication and increases costs.

Innovation Solution

The acquisition module electronics are directly mounted to the top of the meter body, integrating the acquisition section into a single enclosure with the meter body, while the interface section is housed in an upper enclosure, simplifying the design and reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If two separate enclosures are used for electronics (flameproof enclosure for CPU module and intrinsically safe base enclosure for acquisition module), then safety and functional separation are improved, but device complexity and manufacturing cost increase

Engineering Contradiction:
ImprovesafetyVSAvoidenclosure structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the flameproof enclosure and intrinsically safe base enclosure into a single integrated enclosure structure. The acquisition module is mounted directly to the meter body within this unified enclosure, eliminating the need for separate enclosures while maintaining safety requirements through proper certification of the integrated design.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated enclosure serves multiple functions simultaneously: it provides the flameproof containment for the CPU module, houses the intrinsically safe acquisition module electronics, and acts as the structural meter body. This multi-functional design reduces the number of separate components needed.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If two separate enclosures are used for electronics, then functional separation is improved, but ease of manufacture deteriorates

Engineering Contradiction:
Improvefunctional separationVSAvoidfabrication
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent merges the fabrication processes into a single enclosure design. The integrated enclosure can be manufactured as one piece or pre-assembled unit, reducing the number of manufacturing steps, quality control checkpoints, and assembly operations required compared to producing and assembling two separate enclosures.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If two separate enclosures are used for electronics, then component protection is improved, but cost increases

Engineering Contradiction:
Improvecomponent protectionVSAvoidcost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent consolidates the enclosure components into a single integrated unit, reducing material costs, manufacturing costs, and assembly costs. The integrated enclosure is certified for both flameproof and intrinsically safe requirements, eliminating the need for two separately certified enclosures and reducing overall system cost.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20250314511A1Integrated enclosure for ultrasonic flowmeter
Publication Date: 2025.10.09 MICRO MOTION INC
  • US20250314511A1 patent drawing
  • US20250314511A1 patent drawing
  • US20250314511A1 patent drawing

AI summary

A sonic- or ultrasonic flowmeter (200) is disclosed, comprising a body (202) with a machined cylindrically hollow bore configured to be connected to a pipeline, allowing fluid flow through the bore. The body (202) includes a first connector (204) at a first end (206) and a second connector (208) at a second end (210). The flowmeter (200) features meter electronics (220) with an interface section (222) and an acquisition section (224). The meter electronics (220) interface with sensors (235) to determine the degree of fluid flow through the pipeline based on signals from the sensors (235). The acquisition module (234) of the acquisition section (224) communicates with the sensors (235) and is mounted in a recess formed in an external flat region of the body (202). An enclosure form (236) is directly and sealedly attached to the body (202), circumscribing the acquisition module (234). The interface electronics (232) of the interface section (222) are housed in an upper enclosure (226), which is coupled to the enclosure form (236).