Integrated FPC Antenna Layout Without Solder Joint Failures
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Solution Overview
Problem
The existing fabrication process for flexible display apparatuses faces issues such as solder joint failures, dust contamination, and adverse magnetic field effects, which lead to connectivity defects and wrinkle defects in the application of metal foils during the assembly of antennas and flexible printed circuits.
Innovation Solution
A circuit device with a flexible printed circuit portion and an antenna portion integrated on a base substrate, where the conductive layers, including coil lines and conductive lines, are formed in the same process, reducing magnetic field interference and eliminating the need for soldering, and incorporating electromagnetic interference shielding and adhesive layers for secure attachment and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate fabrication processes are used for antennas and flexible printed circuits, then design flexibility is improved, but manufacturing complexity and solder joint failures increase
Solution Approach 1:
The patent merges the antenna and flexible printed circuit into a single integrated structure fabricated on the same base substrate. The conductive layer forms both antenna patterns and circuit traces in one continuous fabrication process, eliminating the need for separate manufacturing steps and soldering operations. This integration maintains design flexibility while significantly reducing manufacturing complexity and eliminating solder joint failures.
Solution Approach 2:
The conductive layer serves multiple functions simultaneously: it acts as both the antenna element and the flexible printed circuit trace. This multi-functionality allows the same structural component to fulfill both wireless communication and electrical connection roles, reducing the number of separate components needed and simplifying the overall manufacturing process.
2Adaptability or versatility
If separate fabrication processes are used for antennas and flexible printed circuits, then design flexibility is improved, but reliability decreases due to solder joint failures
Solution Approach 1:
By combining the antenna and flexible printed circuit into a single integrated structure with continuous conductive paths, the patent eliminates solder joints entirely. The conductive layer forms both antenna patterns and circuit traces in one uninterrupted fabrication process, ensuring reliable electrical connections without the weakness points introduced by soldering operations.
3Object-affected harmful factors
If metal foils are applied during assembly, then electromagnetic shielding is improved, but wrinkle defects occur due to adverse magnetic field effects
Solution Approach 1:
The patent incorporates electromagnetic interference shielding layers and magnetic field management structures during the base substrate fabrication process, before any metal foil application or final assembly. This preliminary integration of shielding functionality prevents magnetic field interference from causing wrinkle defects during subsequent metal foil application, while maintaining surface flatness and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of the assembly by minimizing magnetic field effects, preventing connectivity and wrinkle defects, and ensuring a dust-free environment, thereby improving the stability and performance of flexible display apparatuses.
Implementation Method 1
a magnetic field enhancing layer on the first side of the base substrate, the magnetic field enhancing layer being configured to enhance a magnetic field generated by the one or more coil lines
Implementation Method 2
a first electromagnetic interference shielding layer on a side of a first coverlay layer away from the base substrate, the first electromagnetic interference shielding layer being configured to shield the flexible printed circuit portion from electromagnetic waves
Data Source
AI summary
A circuit device is provided. The circuit device includes a flexible printed circuit portion and an antenna portion. The circuit device includes a base substrate having a unitary structure extending from a region of the antenna portion to a region of the flexible printed circuit portion; and a first conductive layer on a first side of the base substrate. The first conductive layer includes one or more coil lines in the antenna portion and one or more first conductive lines in the flexible printed circuit portion.