Integrated Galvanic Isolator Wireless RF Transmission
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Solution Overview
Problem
Existing integrated galvanic isolators require complex constructional post-processing steps and wire connections, limiting their efficiency and cost-effectiveness, and they are unable to facilitate radiofrequency wireless transmission.
Innovation Solution
An integrated galvanic isolator design featuring two silicon dice with a transmitter circuit and a receiver circuit, where the antennas are formed by dipoles or loop antennas, allowing for radiofrequency signal transfer without the need for connection wires between the dice, and providing a high galvanic isolation of 10 kV with improved common-mode rejection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional transformer-based galvanic isolators are used with separate silicon dice and wire connections, then galvanic isolation is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the transmitter circuit, receiver circuit, and transformer into a single integrated silicon die, eliminating the need for separate dice and wire connections. This integration maintains galvanic isolation functionality while significantly reducing device complexity and eliminating constructional post-processing steps.
Solution Approach 2:
The patent replaces the mechanical wire connections between separate dice with integrated electrical connections on a single die. This substitution eliminates the need for physical wire bonding and assembly steps, reducing both device complexity and manufacturing complexity.
2Productivity
If optical couplers are used for galvanic isolation, then signal transmission is achieved, but fabrication efficiency is low and bit rate is limited
Solution Approach 1:
The patent replaces the electro-optical conversion process with a direct electrical transformation approach using a transformer. This substitution eliminates the need for LED-phototransistor pairs and associated fabrication processes, improving both fabrication efficiency and potential bit rate while maintaining galvanic isolation.
3Reliability
If capacitive interface devices are used for galvanic isolation, then signal transfer is achieved, but immunity to common-mode voltage transients is reduced
Solution Approach 1:
The patent replaces the capacitive interface with a transformer-based magnetic coupling system. This substitution provides inherent common-mode rejection through the transformer's magnetic coupling mechanism, significantly improving immunity to common-mode voltage transients while maintaining signal transfer capability.
4Adaptability or versatility
If traditional galvanic isolators are used, then data transmission is achieved, but radiofrequency wireless transmission is not enabled
Solution Approach 1:
The patent designs the integrated galvanic isolator with a transformer and antenna structure that can operate in both wired and wireless modes. The same hardware infrastructure supports both traditional data transmission and radiofrequency wireless transmission, enabling multi-functionality without increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient radiofrequency wireless data transfer with a single interface, reducing costs and complexity, while achieving high transceiving rates and reliability, and is adaptable for both monochannel and multichannel operations.
Implementation Method 1
a transmitting antenna 33a... and a receiving antenna 33b for transferring radiofrequency signals wirelessly
Data Source
AI summary
An embodiment of a wireless galvanic isolator device is formed by a transmitter circuit, a receiver circuit, and a wireless coupling structure, arranged between the transmitter circuit and the receiver circuit. The wireless coupling structure is formed by a pair of antennas each arranged on an own die and integrated together with the respective transmitter and receiver circuit. The two dice may be arranged adjacent to each other in a planar configuration or arranged on top of each other and bonded together.


