Integrated 3D Hall Sensor Layout for Low-Cost IC Embedding
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Solution Overview
Problem
The challenge lies in integrating compact sensing technologies within integrated circuitry without significantly increasing manufacturing costs, necessitating the embedding of sensors using existing process steps.
Innovation Solution
A multi-component Hall effect sensor is embedded within integrated circuitry, utilizing a semiconductive body material with an electrically isolated path, distributed current contacts, and sensing contacts to detect magnetic field components, leveraging existing manufacturing processes like trench isolation and reverse-biased P-N junctions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a multi-component Hall effect sensor is embedded within integrated circuitry using existing manufacturing processes, then the sensor can be integrated without significantly increasing manufacturing costs, but the sensor structure becomes more complex requiring multiple contacts and isolated paths
Solution Approach 1:
The patent merges the Hall effect sensor with the integrated circuit by embedding the sensor structure within the IC fabrication process. The semiconductive body material, current contacts, and sensing contacts are all formed as part of the standard IC manufacturing steps, eliminating the need for separate sensor fabrication and integration. This combining approach reduces manufacturing costs while accepting increased structural complexity as inherent to the sensor function.
Solution Approach 2:
The semiconductive body material serves multiple functions: it acts as both the active sensing region for Hall effect measurements and as part of the integrated circuit substrate. The current contacts and sensing contacts are formed using the same photolithography and deposition processes as other IC components. This multi-functionality allows the sensor to be integrated without requiring dedicated manufacturing processes, thereby reducing overall manufacturing costs.
2Ease of manufacture
If existing manufacturing process steps are used to embed the sensor, then manufacturing costs are avoided, but the sensor must be designed to fit within the constraints of standard IC fabrication steps
Solution Approach 1:
The patent adapts the sensor design to fit within standard IC fabrication parameters by using the same photolithography wavelengths, deposition thicknesses, and doping concentrations as other IC components. The semiconductive body material is formed with standard epitaxial growth parameters, and the contacts are created using conventional patterning steps. This parameter alignment allows the sensor to be manufactured using existing processes while maintaining sensing functionality.
Solution Approach 2:
The sensor structure is segmented into distinct functional regions (current focus, distributed current contacts, sensing contacts) that can be formed sequentially using standard IC fabrication steps. Each segment is created using the same process tools and techniques as other IC components, allowing the overall sensor to be integrated without requiring specialized manufacturing equipment or processes.
3Measurement precision
If the sensor detects magnetic field components using Hall effect, then the sensor provides three-dimensional vector component measurement, but the sensor requires precise voltage detection and conversion to magnetic field measurements
Solution Approach 1:
The patent uses the semiconductive body material as an intermediary that converts magnetic field information into voltage signals through the Hall effect. The distributed current flow interacts with the magnetic field to generate Hall voltages that are directly measurable at the sensing contacts. This intermediary conversion process eliminates the need for complex external measurement systems, as the sensor itself performs the transformation from magnetic field to electrical signal.
Solution Approach 2:
The patent replaces mechanical or external measurement systems with an integrated electronic sensing system. Instead of using external magnets or mechanical field generators, the sensor uses electric current flow through the semiconductive body to detect magnetic fields electronically. The voltage detection and conversion are performed within the integrated circuit itself, eliminating the need for separate measurement instruments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient detection of magnetic field components and magnitude within integrated circuits, enhancing versatility and value without additional manufacturing costs.
Implementation Method 1
forming a distributed current flow between an embedded current focus and one or more distributed current contacts on a surface of a body, the distributed current flow exhibiting a Hall effect when acted on by a magnetic field
Data Source
AI summary
Illustrative multi-component Hall effect sensors and sensing methods are suitable for embedding within integrated circuitry. One illustrative integrated circuit device includes: a substrate comprising a semiconductive body material with an upper surface; a focus contact on the upper surface that connects via an electrically isolated path to a embedded current focus within the body material; one or more distributed current contacts on the upper surface that operate in combination with the embedded current focus to form a distributed current flow through the body material; and an arrangement of sensing contacts on the upper surface to detect a set of voltages representing a Hall effect measurement for each three dimensional vector component of a magnetic field acting on the distributed current flow.