Integrated Heat-Conducting Plastic Frame for LED Backlight Thermal Management
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Solution Overview
Problem
High-brightness LEDs in backlight modules experience heat accumulation issues, leading to irreversible deformations in components and reduced service life due to inadequate heat dissipation, which restricts LED arrangement and affects performance.
Innovation Solution
A plastic frame assembly with an integrated heat-conducting component featuring protrusions and through holes enhances heat transfer and dissipation by forming a fin-like structure between LEDs, promoting air circulation and effective heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high-brightness LEDs are used to increase illumination intensity, then illumination intensity is improved, but heat accumulation occurs leading to component deformation and reduced service life
Solution Approach 1:
The patent converts the harmful heat generated by high-brightness LEDs into a beneficial effect by designing a reflective sheet with a light-reflecting layer that has heat-conducting properties. The heat-conducting adhesive layer and metal foil in the reflective sheet conduct heat away from the LED, transforming the harmful thermal energy into a useful heat dissipation mechanism that extends component service life while maintaining high illumination intensity.
Solution Approach 2:
The patent introduces heat-conducting adhesive layers and metal foil as intermediary elements between the LED and the reflective sheet. These intermediaries serve as thermal pathways that transfer heat from the LED to the reflective sheet and ultimately to the surrounding environment, enabling effective heat management without compromising the optical performance or structural integrity of the backlight module.
2Illumination intensity
If high-brightness LEDs are used to increase illumination intensity, then illumination intensity is improved, but local temperature increases causing irreversible warp deformations
Solution Approach 1:
The patent converts the harmful localized heat into a beneficial distributed thermal pattern by using the reflective sheet's heat-conducting adhesive layer and metal foil to spread heat laterally. This transforms concentrated thermal energy at the LED into distributed heat across the reflective sheet surface, preventing localized overheating and warp deformations while maintaining high brightness output.
Solution Approach 2:
The patent addresses localized heating by introducing lateral heat conduction through the reflective sheet structure. The heat-conducting adhesive layer and metal foil create thermal pathways in the horizontal dimension, transferring heat from the vertical heat source (LED) to the surrounding lateral areas, effectively reducing peak temperatures and preventing thermal deformation.
3Productivity
If multiple LEDs are arranged densely to increase productivity, then productivity is improved, but heat accumulation worsens causing adverse deformation
Solution Approach 1:
The reflective sheet serves multiple functions simultaneously: it reflects light to maintain illumination performance, conducts heat away from LEDs through its adhesive layer and metal foil, and provides structural support for the backlight module. This multi-functionality allows dense LED arrangement without compromising thermal management, enabling higher productivity while controlling heat accumulation.
Solution Approach 2:
The patent uses metal foil with heat-conducting properties as a thermal management layer within the reflective sheet structure. This metal foil copying the LED arrangement pattern creates parallel thermal pathways that efficiently conduct heat from multiple densely packed LEDs, enabling high LED density while preventing heat accumulation and adverse deformations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated heat-conducting structure effectively manages heat dissipation, preventing component deformations and extending the service life of backlight sources while allowing for more flexible LED arrangements.
Implementation Method 1
the heat-conducting component comprises a heat-conducting member and a plurality of protrusions protruded from a surface of the heat-conducting member
Implementation Method 2
the protrusions being inserted into the plastic frame at the engagement structure thereof... forming a fin-like structure between LEDs, promoting air circulation and effective heat removal
Data Source
AI summary
The present disclosure discloses a plastic frame assembly. In one embodiment, the plastic frame assembly includes a plastic frame and a heat-conducting component which are formed in an integrated structure; wherein, the plastic frame includes an engagement structure configured to be engaged with an other component; and, the heat-conducting component includes a heat-conducting member and a plurality of protrusions protruded from a surface of the heat-conducting member, the protrusions being inserted into the plastic frame at the engagement structure thereof. The present disclosure also discloses a backlight source including this plastic frame assembly and a display apparatus including the abovementioned backlight source.