Integrated Heat Dissipation Device for Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face inefficiencies in heat dissipation, particularly for high-heat-generating chips like CPUs, as existing heat spreader and heat pipe lid solutions either lack sufficient heat dissipation efficiency or suffer from reliability issues due to detachment and limited contact areas.
Innovation Solution
A semiconductor package with a heat dissipating device featuring an accommodating room and openings for cooling fluid, encapsulated within an encapsulant, which can be externally connected to a heat exchange system for enhanced heat transfer, and optionally using an interface layer to optimize adhesion and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heat spreader or heat pipe lid is used, then heat dissipation is provided, but the heat dissipation efficiency is insufficient for high-heat-generating chips
Solution Approach 1:
The patent combines the heat spreader and heat pipe lid into an integrated heat dissipation device. The heat spreader base is directly coupled to the heat pipe array, forming a unified structure that eliminates detachment risks between separate components while maximizing heat transfer efficiency from the chip to the cooling fluid.
Solution Approach 2:
The heat dissipation device uses composite construction with a heat spreader base made of thermally conductive material and heat pipes made of materials optimized for phase change heat transfer. This composite approach allows each component to be optimized for its specific function while working together as a unified system.
2Temperature
If the heat spreader top surface is exposed to dissipate heat, then heat dissipation is improved, but the fabrication process becomes complicated due to mold cavity constraints
Solution Approach 1:
Instead of exposing the top surface of the heat spreader for heat dissipation, the patent utilizes the bottom surface of the heat spreader base that contacts the chip. This dimensional shift allows heat dissipation through the encapsulant without creating mold cavity interference, simplifying the fabrication process while maintaining effective heat transfer.
3Temperature
If a heat pipe lid is used to improve heat dissipation, then heat transfer efficiency is improved, but the structure becomes complex and detachment issues occur
Solution Approach 1:
The patent merges the heat spreader and heat pipe lid into a single integrated heat dissipation device. The heat pipe array is directly coupled to the heat spreader base, eliminating the need for separate mounting steps and reducing structural complexity while maintaining effective heat transfer from the chip through the encapsulant.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat dissipation efficiency and reliability by maximizing heat transfer area and preventing detachment issues, effectively managing heat from high-heat-generating chips.
Implementation Method 1
a cooling fluid to be received in the accommodating room to absorb and dissipate heat produced from the chip
Implementation Method 2
absorb and dissipate heat produced from the chip
Implementation Method 3
an encapsulant formed between the heat dissipating device and the substrate to encapsulate the chip
Data Source
AI summary
A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.