Integrated Heat Pipe Assembly for IC Thermal Management
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Solution Overview
Problem
Existing heat exchanger designs for integrated circuits, such as flattened round heat pipes, often result in inadequate heat transfer due to insufficient surface area contact and thermal discontinuity, leading to inefficient heat dissipation and space utilization.
Innovation Solution
A heat transfer apparatus featuring a single casting formed around a heat transfer medium, which defines heat sinks for thermal communication with integrated circuits, enhancing heat transfer efficiency by providing a unified, integral structure that improves thermal conductivity and surface area contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If two heat pipes are used in a side-by-side relationship to compensate for insufficient width, then the surface area contact with integrated circuits is improved, but the device complexity and space utilization are worsened
Solution Approach 1:
The patent merges multiple heat pipes into a single integrated heat pipe assembly with a unified structure that contacts multiple integrated circuits simultaneously. This eliminates the need for separate side-by-side heat pipe installations while maintaining adequate surface area contact through the extended geometry of the single assembly.
Solution Approach 2:
The single heat pipe assembly is designed to serve multiple functions by contacting multiple integrated circuits (e.g., both northbridge and southbridge) simultaneously. This multi-functional design replaces the need for multiple dedicated heat pipes, reducing device complexity while maintaining effective heat transfer coverage.
2Length of stationary object
If two heat pipes are used in a side-by-side relationship, then the width is sufficient for heat transfer, but thermal discontinuity between heat pipes and integrated circuits occurs
Solution Approach 1:
The patent creates a unified heat pipe assembly where the heat transfer medium is continuous throughout the structure, eliminating thermal discontinuities that would occur between separate heat pipes. The single integrated structure ensures consistent thermal contact across all integrated circuits without gaps or interfaces between multiple components.
3Reliability
If a single casting is formed about the heat transfer medium, then thermal continuity and heat transfer efficiency are improved, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates the heat pipe assembly and heat sink structure into a single pre-formed casting that is installed as one unit. This preliminary integration of multiple functions into a single manufacturable component simplifies the overall assembly process while maintaining thermal continuity, as the casting is designed to accommodate the heat transfer medium and provide structural support in one manufacturing step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat transfer efficiency by ensuring effective thermal communication between integrated circuits and heat sinks, addressing the limitations of traditional heat exchanger configurations and improving space utilization and heat dissipation capabilities.
Implementation Method 1
a heat transfer medium is provided with a first end in thermal communication with a first integrated circuit and a second end in thermal communication with a second integrated circuit
Implementation Method 2
a single casting formed about the heat transfer medium and defining at least one heat sink
Implementation Method 3
a single casting formed about the heat transfer medium and defining at least one heat sink
Data Source
AI summary
A heat transfer apparatus and method are provided for transferring heat between integrated circuits. In use, a heat transfer medium is provided with a first end in thermal communication with a first integrated circuit and a second end in thermal communication with a second integrated circuit. Furthermore, a single casting formed about the heat transfer medium and defining at least one heat sink is provided for thermal communication with the first integrated circuit or the second integrated circuit.