Integrated Heat Pipe Fabrication via Additive Manufacturing
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Solution Overview
Problem
Traditional heat pipe manufacturing methods are limited by complex and custom geometry requirements, leading to thermal efficiency losses due to interface issues with electronic systems, as they cannot be seamlessly integrated within solid structures.
Innovation Solution
A method for fabricating an integrated heat pipe using additive manufacturing, where a CAD model combines a porous wick structure and a solid conducting structure, allowing for 3D printing with varying porosity and mechanical interference, enabling direct integration within electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional heat pipe manufacturing methods are used, then heat pipes can be produced with standard geometries, but they cannot be seamlessly integrated within solid structures leading to interface thermal losses
Solution Approach 1:
The patent merges the heat pipe structure with the solid conducting structure into a single integrated component. The heat pipe is embedded within the bulk of the solid structure rather than being assembled separately, eliminating interface thermal losses and enabling seamless integration within electronic systems.
Solution Approach 2:
The patent applies different porosity values to different regions of the heat pipe structure. The porous wick structure has varying porosity (0.3-0.7) optimized for capillary action in specific regions, while maintaining solid conducting regions for thermal conduction. This local differentiation optimizes both capillary pumping and thermal conduction functions.
2Adaptability or versatility
If traditional manufacturing methods are used, then standard components can be produced, but geometry possibilities are severely limited preventing custom integration
Solution Approach 1:
The patent utilizes additive manufacturing parameters (porosity, layer height, infill patterns) to create heat pipes with complex custom geometries that would be impossible with traditional manufacturing. The porosity parameter is varied spatially to create different functional regions within the same component, enabling both geometric flexibility and functional optimization.
Solution Approach 2:
The patent transitions from 2D/3D assembly of separate components to 4D printing where the heat pipe structure evolves during manufacturing. The additive process allows the heat pipe to be built layer-by-layer with varying porosity and geometry, creating integrated structures that combine thermal conduction and capillary pumping functions in a single monolithic component.
3Reliability
If heat pipes are assembled onto exterior surfaces, then they can be attached to thermal loads, but interface thermal losses occur due to contact resistance
Solution Approach 1:
The patent merges the heat pipe with the solid conducting structure into a single integrated component. The heat pipe is embedded within the bulk of the solid structure rather than being assembled separately, eliminating interface thermal losses and enabling seamless integration within electronic systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal management by reducing interface losses and allowing for more efficient heat transfer within electronic systems, suitable for diverse operational environments.
Implementation Method 1
The liquid then returns to the evaporator through either capillary, gravitational, or centrifugal forces
Implementation Method 2
After absorbing the heat, the working fluid undergoes a phase transition to the vapor state and is transported through an open cavity along the length of the heat pipe. After contacting the interior surfaces of the condenser, the vapor undergoes another phase transition back to liquid, thereby releasing the latent heat of vaporization through the heat sink.
Implementation Method 3
the vapor undergoes another phase transition back to liquid, thereby releasing the latent heat of vaporization through the heat sink
Implementation Method 4
Heat pipes and vapor chambers are passive, closed-cycle thermal transfer devices that rely on the principles of both thermal conductivity and phase transition to efficiently transfer heat
Data Source
AI summary
A method for fabricating an integrated heat pipe is disclosed. The integrated heat pipe includes a porous wick structure, a solid conducting structure, and an integrated part. In a CAD model, the porous wick structure is represented as a simple solid having a finite amount of mechanical interference; the solid conducting structure and the integrated part are represented as simple solids. After incorporating the CAD model into a 3D-printer build file, 3D-printer parameters representing the porous wick structure of the integrated heat pipe are assigned to a porous region component model within the 3D-printer build file, and standard 3D-printer parameters representing the solid conducting structure and the integrated part are assigned to a solid region component model within the 3D-printer build file. The 3D-printer build file is utilized to print the integrated heat pipe on a 3D printer.