Integrated Heat-Pipe Heat Sink for High-Power Display Panels
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Solution Overview
Problem
High power consumption in display panels, particularly in head-mounted displays, leads to excessive heat generation, which can be detrimental to user safety due to proximity to the eyes, and existing heat dissipation methods are inadequate for effectively managing this heat.
Innovation Solution
A heat sink with a heat pipe structure, including a base and fins, where a heat pipe with a spiral configuration extends through the fins, facilitating rapid heat diffusion and dissipation using a pulsating heat pipe mechanism without external power, coupled to the display panel for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high power is used to increase luminance, then display performance is improved, but heat generation increases causing safety issues
Solution Approach 1:
The patent extracts the heat dissipation function from the conventional heat sink structure by integrating a heat pipe mechanism. The heat pipe separates the heat absorption function (at the base contacting the display panel) from the heat dissipation function (at the fins exposed to air), enabling more efficient heat removal while maintaining high luminance operation.
Solution Approach 2:
The heat pipe acts as an intermediary substance between the heat source (display panel) and the heat sink (fins). It transfers heat efficiently through phase change of the working fluid inside the heat pipe, mediating the heat transfer process and enabling effective thermal management even under high power consumption conditions.
2Loss of energy
If conventional heat dissipation methods are used, then heat removal is provided, but temperature reduction is insufficient under high power consumption
Solution Approach 1:
The heat pipe utilizes phase transitions of the working fluid (evaporation at the heat source and condensation at the heat dissipation section) to achieve efficient heat transfer. This phase change mechanism enables superior heat removal performance compared to conventional conduction-only heat sinks, effectively reducing panel temperature under high power consumption.
Solution Approach 2:
The patent extends the heat dissipation into another dimension by adding vertical fins that protrude from the base. This three-dimensional fin structure increases the heat dissipation surface area compared to a flat heat sink, enabling more effective heat removal and lower operating temperatures.
3Reliability
If heat sink structure is added, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat pipe mechanism with the heat sink structure into a single integrated component. The heat pipe base and fins are formed as one piece, combining the heat conduction function of the base with the heat dissipation function of the fins, thereby improving heat dissipation performance while avoiding the complexity of assembling separate components.
Solution Approach 2:
The heat sink is segmented into functional zones: the base for heat absorption, the heat pipe pathway for heat transport, and the fins for heat dissipation. This segmentation allows each part to be optimized for its specific function while maintaining overall structural simplicity through integral formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed heat sink design significantly reduces panel temperature by efficiently dissipating heat through all fins, achieving lower temperatures compared to conventional methods, even under high power consumption, thereby ensuring safer operation and improved performance.
Implementation Method 1
a heat pipe formed inside the main body and having a path passing through the base and the fins
Implementation Method 2
facilitating rapid heat diffusion and dissipation using a pulsating heat pipe mechanism
Implementation Method 3
fins that protrude downward from the base and are spaced apart from each other
Implementation Method 4
heat sink having relatively high heat dissipation performance
Data Source
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AI summary
A display device includes: a display panel; and a heat sink under the display panel, wherein the heat sink includes: a main body including a base and fins that protrude downward from the base and are spaced apart from each other; and a heat pipe formed inside the main body and having a path passing through the base and the fins.