Integrated Heat Pipe Wick Structure for Compact Thermal Transfer

The patent merges the heat receiving portion, heat dissipation portion, connecting portion, and wicks into a single integrally formed heat pipe component. This eliminates the need for separate manufacturing and assembly processes for each part, thereby reducing manufacturing process complexity while maintaining the functional adaptability of each component through optimized geometric design during the single manufacturing process.

By integrating all heat pipe components into a single monolithic structure, the patent eliminates assembly steps entirely while reducing the overall device thickness. The integral design allows for optimized spatial arrangement of internal features, achieving a more compact form factor compared to assembled multi-part configurations.

The patent implements non-uniform wick distribution with higher wick density at the periphery of the cross section and lower density at the center. This local quality variation optimizes heat exchange efficiency by positioning wicks where they can most effectively contact the heat transfer surfaces, while the specific density gradient pattern is achieved through controlled manufacturing processes.

The patent employs additive manufacturing technology, which builds the heat pipe component layer by layer with precise digital control over geometric parameters. This manufacturing method inherently provides the necessary precision for complex integral geometries while maintaining process simplicity, as the digital model directly controls the final shape without requiring complex tooling or multi-step machining operations.