Integrated Heat Sink Airflow Guide for Compact Electronics
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Solution Overview
Problem
In electronic devices, particularly in vehicles and other compact applications, there is a challenge in effectively cooling heat-generating components due to space constraints and the need for high packing density, where conventional cooling methods are inadequate in efficiently dissipating heat while maintaining electromagnetic compatibility and avoiding dust interference.
Innovation Solution
The electronic device incorporates a heat dissipating structure that also serves as an airflow guiding structure, guiding cooling air directly to heat-generating units while maintaining mechanical stability and electromagnetic compatibility by using heat-conducting materials for the dissipating structure, which extends along the housing to delimit the airflow path effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling air is used to cool heat-generating components, then heat dissipation is achieved, but cooling air may reach sensitive components causing dust interference and electromagnetic compatibility issues
Solution Approach 1:
The patent merges the heat dissipating structure and airflow guiding structure into a single integrated component. The heat dissipating structure includes guiding surfaces that direct cooling air away from sensitive components while maintaining effective heat transfer, thereby combining cooling and airflow control functions to eliminate dust interference and electromagnetic compatibility issues
Solution Approach 2:
The guiding surfaces on the heat dissipating structure act as intermediaries that control and direct the cooling air flow. These surfaces guide the air along predetermined paths that bypass sensitive components, serving as a mediator between the cooling air source and the heat-generating components while preventing harmful air flow to other areas
2Volume of moving object
If packing density is increased to reduce device size, then space efficiency is improved, but heat dissipation becomes more difficult due to limited space for cooling mechanisms
Solution Approach 1:
The heat dissipating structure performs multiple functions simultaneously: it dissipates heat from heat-generating components, guides cooling air flow along predetermined paths, and protects sensitive components from dust and electromagnetic interference. This multi-functionality allows effective heat dissipation in compact spaces without requiring separate cooling mechanisms
Solution Approach 2:
The patent combines the heat dissipating structure with airflow guiding surfaces into a single integrated component, eliminating the need for separate cooling air channels and reducing overall device volume while maintaining effective heat dissipation capability
3Temperature
If separate cooling air channels are provided to guide cooling air, then heat dissipation is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent merges the heat dissipating structure and airflow guiding structure into a single integrated component. The heat dissipating structure includes guiding surfaces that direct cooling air through the housing, eliminating the need for separate cooling air channels and reducing device complexity while maintaining effective heat dissipation
Solution Approach 2:
The integrated heat dissipating structure serves multiple functions: heat dissipation, airflow guidance, and protection of sensitive components. This multi-functionality reduces the number of separate components needed, thereby reducing device complexity and space requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides an efficient cooling mechanism that effectively dissipates heat from multiple heat-generating units within the device, maintains electromagnetic compatibility, and avoids cooling air from reaching sensitive components, thereby ensuring proper functioning and reduced dust interference.
Implementation Method 1
the heat generating unit is coupled to the heat dissipating structure having a high thermal conductivity
Implementation Method 2
cooling air moving in the electronic device removing the generated heat
Data Source
Figure 1~2
Figure 3~4
AI summary
The present invention relates to an electronic device comprising: - at least one first heat generating unit (40), - a housing (20) in which said at least one first heat generating unit is installed, - an airflow guiding structure adapted to guide cooling air through the housing for cooling said heat generating unit, - a first heat dissipating structure (50) coupled to said at least one first heat generating unit for dissipating the generated heat, wherein the airflow guiding structure is at least partly built by said first heat dissipating structure.