Integrated Heat Sink Structure for Electronic Circuit Devices

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Solution Overview

Problem

Conventional backflow prevention and ORing circuits, when configured as external electronic circuit devices, face challenges in space efficiency and safety due to heat dissipation requirements and the risk of improper connections, which can lead to ignition.

Innovation Solution

An electronic circuit device with a heat sink structure that includes a contact part, a tabular heat-dissipating part, and a connection part, where the heat-dissipating part serves as an indication part to indicate connection information, enhancing both heat dissipation and safety while maintaining space efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the backflow prevention circuit or ORing circuit is configured as an external electronic circuit device with respect to the power-supply device, then versatility and cost are improved, but space efficiency deteriorates due to the need for dedicated heat sink structure

Engineering Contradiction:

ImproveversatilityVSAvoidspace efficiency

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent merges the heat sink structure with the circuit device housing into a single integrated component. The heat sink structure includes a heat dissipation plate that is integrally formed with the housing, eliminating the need for separate heat sink components while maintaining effective heat dissipation functionality. This integration resolves the space efficiency issue by combining multiple functions into one compact structure.

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If the backflow prevention circuit or ORing circuit is configured as an external electronic circuit device, then versatility and cost are improved, but safeness deteriorates due to the risk of improper connection leading to ignition

Engineering Contradiction:

ImproveversatilityVSAvoidsafeness

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent incorporates indication markings on the heat sink structure that clearly show the correct connection orientation and polarity before the device is connected to the power supply. These markings are prepared in advance during manufacturing, allowing users to correctly identify connection directions and avoid improper connections that could lead to overheating or ignition. This preliminary indication action prevents safety issues before they can occur.

Inventive Principle:

Principle #10Preliminary action

3Temperature

If a dedicated heat sink device is provided to ensure sufficient heat dissipation performance, then heat dissipation is improved, but space efficiency deteriorates

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidspace efficiency

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The heat sink structure is integrally formed with the housing as a unified component, combining the structural housing function with the thermal management function. The heat dissipation plate is built into the housing structure itself, eliminating the need for additional dedicated heat sink devices while maintaining sufficient heat dissipation performance. This merging approach resolves the contradiction between heat dissipation effectiveness and space utilization.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively improves space efficiency and safety by efficiently dissipating heat and preventing improper connections through integrated indication on the heat sink structure, ensuring reliable operation and reduced risk of ignition.

Implementation Method 1

a heat sink structure configured to dissipate heat radiated by the electronic component requiring heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

dissipate heat radiated by the electronic component requiring heat dissipation

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS9980377B2Electronic circuit device and heat sink structure for the same

Publication Date: 2018.05.22 TDK CORP

AI summary

An electronic circuit device and a heat sink structure for the electronic circuit device capable of simultaneously achieving improved space efficiency and safeness are provided. The electronic circuit device includes: a substrate with circuit wiring formed thereon; an electronic component requiring heat dissipation, which is mounted on the substrate; and a heat sink structure configured to dissipate heat radiated by the electronic component requiring heat dissipation. The heat sink structure includes: a contact part to be in direct or indirect contact with the electronic component requiring heat dissipation; a generally tabular heat-dissipating part disposed substantially parallel to the substrate; and a connection part configured to connect between the contact part and the heat-dissipating part.