Integrated Heat Sink Package With Electroplated Cooling Fins
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Solution Overview
Problem
Existing electronic devices face inefficiencies in heat dissipation, leading to performance degradation, and current solutions involving separate heat sinks are costly and less efficient due to the use of thermally resistant polymers and adhesives.
Innovation Solution
An integrated device package with an embedded heat sink is manufactured by electroplating a metal layer onto the device's surface using photolithography, forming projections such as fins or pins to enhance heat dissipation without the need for adhesives, thereby increasing the surface area for convective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If separate heat sinks are used with thermally resistant polymers and adhesives, then heat dissipation is achieved, but manufacturing cost and thermal resistance increase
Solution Approach 1:
The patent merges the heat sink function directly into the package substrate by integrating a metal layer (copper or aluminum) into the substrate structure itself. This eliminates the need for separate heat sink components and thermally resistant adhesives, thereby reducing manufacturing steps, material costs, and thermal resistance at the interface between the heat-generating component and the heat dissipation structure.
2Temperature
If electroplating is used to create integrated heat sink, then heat dissipation surface area increases, but manufacturing process complexity increases
Solution Approach 1:
The electroplating process used to create the integrated heat sink is the same process already employed in standard PCB manufacturing for creating conductive traces and vias. By utilizing this existing manufacturing capability for a dual-purpose function (both electrical connectivity and thermal management), the patent avoids adding significant process complexity while achieving enhanced heat dissipation surface area through the formation of projections such as fins or pins.
3Temperature
If thermally resistant polymers and adhesives are used to attach heat sinks, then heat dissipation is achieved, but thermal resistance and material costs increase
Solution Approach 1:
The patent extracts and eliminates the thermally resistant polymer and adhesive layers from the heat dissipation path. By integrating the heat sink function directly into the metal substrate, the invention removes these intermediate materials that inherently possess high thermal resistance, thereby reducing both material costs and thermal resistance in the heat transfer path from the electronic component to the ambient environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides efficient heat dissipation with reduced material and processing costs, allowing the device to operate at high power densities without the drawbacks of separate heat sinks, such as increased material and adhesive-related inefficiencies.
Implementation Method 1
electroplating an integrated heat sink onto the first surface, wherein electroplating the integrated heat sink comprises adding a metal layer over the first surface
Implementation Method 2
forming, by a photolithography process, the metal layer in a shape for dissipating heat
Implementation Method 3
increasing the surface area for convective cooling
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
An integrated device package is disclosed. The integrated device package can include an electronic component package which includes an electronic component. The integrated device package can include a protective material in which the electronic component is at least partially embedded, wherein the electronic component package comprises a first surface and a second surface. The integrated device package can include a heat sink plated on the first surface. The heat sink can include a base portion and a plurality of heat-dissipating projections extending outwardly therefrom.