Integrated Heat Sink Assembly for PCB Temperature Control
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Solution Overview
Problem
Computing devices deployed in harsh environmental conditions often operate outside their designed temperature range, leading to improper functioning and potential damage due to inadequate heat dissipation or cooling mechanisms.
Innovation Solution
A computing device with a heat dissipation component and a heating or cooling apparatus, featuring a heating or cooling component affixed to a surface of the heat dissipation component, which is configured to heat or cool a printed circuit board component through thermal conduction, using resistive heaters and coolers to maintain the component within its operating temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat dissipation mechanisms are used in harsh environmental conditions, then the device structure remains simple, but the computing device operates outside its designed temperature range leading to improper functioning and potential damage
Solution Approach 1:
The patent combines the heating/cooling apparatus with the heat dissipation component into an integrated assembly. The heating or cooling component is affixed to a surface of the heat dissipation component, creating a unified thermal management system that maintains reliability in harsh conditions while avoiding the complexity of separate independent systems
Solution Approach 2:
The heat dissipation component serves dual functions: it dissipates heat during normal operation and acts as a thermal conduit for the heating or cooling apparatus to regulate temperature in harsh environmental conditions. This multi-functionality improves reliability without proportionally increasing system complexity
2Temperature
If heating or cooling components are added to maintain temperature in harsh conditions, then the operating temperature range is maintained, but the device complexity increases
Solution Approach 1:
The heating or cooling component is integrated with the heat dissipation component rather than being a separate system. This merging approach enables temperature control in harsh conditions while minimizing the increase in device complexity by sharing structural and thermal pathways
Solution Approach 2:
The heat dissipation component acts as an intermediary between the heating or cooling apparatus and the printed circuit board component. It conducts thermal energy from the heating/cooling component to the PCB component, enabling temperature control while maintaining a manageable system architecture
3Reliability
If an integrated heating or cooling apparatus is affixed to the heat dissipation component, then the printed circuit board component is maintained within operating temperature range, but the manufacturing complexity increases
Solution Approach 1:
The heating or cooling apparatus is affixed to the heat dissipation component to form an integrated assembly that can be manufactured and assembled as a unit. This approach ensures temperature stability for the PCB component while managing manufacturing complexity through standardized integration processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains the printed circuit board component within its designed operating temperature range, ensuring stable and functional operation in harsh conditions, while also allowing for conventional heat dissipation when equilibrium conditions are met.
Implementation Method 1
the heating or cooling component is affixed to a surface of the heat dissipation component... configured to heat or cool the printed circuit board component
Implementation Method 2
using resistive heaters and coolers to maintain the component within its operating temperature range
Data Source
AI summary
A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.