Integrated Heat Sink for Power Modules and Transistors
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Solution Overview
Problem
High-power and high-density electronic devices generate significant heat, requiring multiple heat sinks that occupy large space on circuit boards, complicating heat dissipation and design due to separate disposition of inverter modules and switching components.
Innovation Solution
An integrated electronic device design where the power module and transistors are attached to different sides of a single heat sink, reducing the number of heat sinks needed and allowing direct airflow without a wing guide plate, thus minimizing circuit board space and enhancing power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If inverter module and switching components are disposed on separate heat sinks, then heat dissipation is achieved, but circuit board area occupied increases
Solution Approach 1:
The patent combines multiple heat sinks (first heat sink for inverter module, second heat sink for switching components, and third heat sink for capacitor components) into a single integrated heat sink structure. This merging reduces the total number of separate heat sink components and decreases the overall area occupied on the circuit board while maintaining effective heat dissipation for all high-heat-generating components.
2Temperature
If wing guide plate is provided for guiding forced airflow, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent removes the wing guide plate component from the system by redesigning the heat sink structure itself to provide airflow guidance functions. The integrated heat sink incorporates internal channels and structures that guide forced airflow directly to the heat dissipation areas, eliminating the need for separate wing guide plates and simplifying the overall duct design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces circuit board area by approximately 30% and simplifies airflow duct design, improving heat dissipation efficiency and practicality by consolidating heat dissipation on a single heat sink.
Implementation Method 1
the power body is attached to the first placement plane... the transistor body is attached to the second placement plane... heat of different heating components at different places can be dissipated by the heat sink
Implementation Method 2
airflows generated by the fan can be directly blown to the heat sink
Data Source
AI summary
An electronic device with heat sink is provided. The heat sink includes a base and fins. One side of the base has a first placement plane and a second placement plane. The electronic device includes a circuit board, a power module and transistors. The power module includes a power body and soldering legs, and the power body is attached to the first placement plane. The transistor has a transistor body and pins, and the transistor body is attached to the second placement plane. The circuit board is disposed at one side of the base formed with the first placement plane, and soldering legs of the power module and pins of the transistor are inserted on the circuit board. Thereby the heat sinks and the space which the circuit board occupied will be reduced for increasing the power density of the heat sink.