Integrated Heat Spreader Display for Memory Systems
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Heat dissipation devices for memory systems, such as SSDs, obstruct the display structures, making it difficult for users to observe the working state, and introduce complexity and reliability issues with external routing connections.
Innovation Solution
A memory apparatus with a heat dissipation device integrated with a display structure on its heat spreader, using internal routing and elastic metal reeds for contact, allowing users to observe the working state without external connections, enhancing aesthetics and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation device is added to the memory system, then heat dissipation performance is improved, but the display structure is obstructed and visibility of working state deteriorates
Solution Approach 1:
The patent combines the heat dissipation device and display structure into a single integrated component. The display structure is positioned on the heat dissipation device housing, allowing both heat dissipation function and visual state indication to coexist without obstruction. This merging resolves the contradiction by making the two previously conflicting components part of a unified structure.
2Ease of operation
If external routing connections are used to connect display structure to memory system, then display functionality is achieved, but device complexity and reliability deteriorate
Solution Approach 1:
The display structure is integrated directly into the heat dissipation device housing, eliminating the need for separate external routing connections. The display components are positioned on the housing surface with direct visual access, removing complex wiring requirements and improving reliability by reducing connection points.
3Ease of operation
If external routing connections are used for display structure, then display functionality is achieved, but reliability deteriorates due to wear-related issues
Solution Approach 1:
By integrating the display structure into the heat dissipation device housing, the patent eliminates external routing connections that would otherwise wear over time. The display components are fixed directly on the housing, removing movable connection points that are susceptible to wear, thus improving long-term reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy observation of the memory system's state while reducing complexity and improving reliability by eliminating external routing faults and wear-related issues, thus enhancing user experience and product trust.
Implementation Method 1
a second interface coupling structure provided on a second side of the heat spreader, the display structure is coupled with the second interface coupling structure
Data Source
AI summary
The present disclosure provides memory systems, heat dissipation devices, and control methods. An example memory system includes a circuit board, wherein the circuit board is provided with a memory device and a first interface coupling structure. The memory device is coupled with the first interface coupling structure. The memory device is configured to: send a state indication signal to a heat dissipation device through the first interface coupling structure, wherein the state indication signal is configured to indicate working state information of the memory system.