Integrated Heat Spreader with Segmented Thermal Contacts
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Solution Overview
Problem
The microelectronic industry faces challenges in fabricating integrated heat spreaders for multi-chip packages due to the complexity and cost of current designs, which struggle to effectively manage varying heights between microelectronic devices and efficiently transfer heat.
Innovation Solution
An integrated heat spreader design featuring a heat spreader frame with openings that secure thermally conductive structures of varying thicknesses, allowing for thermal contact without the need for welding or adhesives, thereby compensating for differing device heights and facilitating heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional integrated heat spreader designs are used, then heat transfer capability is maintained, but fabrication complexity and cost increase
Solution Approach 1:
The heat spreader is divided into a frame structure with multiple openings, and separate thermally conductive structures are placed within each opening. This segmentation allows independent positioning and thickness adjustment of each thermal contact element, simplifying fabrication while maintaining effective thermal contact with chips of varying heights
Solution Approach 2:
Different regions of the heat spreader are designed with different local properties - the frame provides structural support while the thermally conductive structures within openings provide localized thermal contact. Each thermally conductive structure can have customized thickness to match the specific height of the chip it contacts, optimizing thermal transfer at each location
2Ease of manufacture
If uniform thickness heat spreader is used, then fabrication is simplified, but thermal contact with varying height devices is compromised
Solution Approach 1:
Instead of a uniform thickness design, the heat spreader uses a segmented structure where the frame has one thickness and the thermally conductive structures have different thicknesses. This allows each thermal contact point to be optimized for its specific chip height while keeping the overall fabrication process relatively simple
Solution Approach 2:
The thickness parameter of the thermally conductive structures is varied to match different chip heights. By changing this geometric parameter locally rather than uniformly, the design achieves effective thermal contact with varying height devices without requiring complex non-uniform frame construction
3Strength
If welding or adhesives are used to secure thermally conductive structures, then structural integrity is improved, but fabrication complexity and cost increase
Solution Approach 1:
The thermally conductive structures are designed to be self-securing within the frame openings through interference fits or friction-based retention. The structures automatically position and secure themselves without requiring external welding or adhesive processes, maintaining structural integrity while simplifying fabrication
Solution Approach 2:
The complex joining processes (welding, adhesives) are extracted and removed from the fabrication process. Instead, a simpler mechanical retention method is used where the thermally conductive structures are held in place by the frame geometry itself, eliminating the need for additional joining steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the complexity and cost of heat spreader fabrication while effectively managing thermal contact across devices of varying heights, enhancing heat transfer efficiency and preventing damage from high temperatures in multi-chip packages.
Implementation Method 1
a plurality of thermally conductive structures, each having a first surface, an opposing second surface, a least one sidewall extending between the thermally conductive structure first surface and the thermally conductive structure second surface
Data Source
AI summary
An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.