Integrated Heat Spreader Substrate for Thermal Management
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Solution Overview
Problem
Densely integrated semiconductor dies generate significant heat, which is not efficiently dissipated by conventional substrates with poor thermal properties, leading to potential failure or degraded performance, and existing heat spreader designs in substrates are costly and inefficient to manufacture.
Innovation Solution
A substrate with an integrated heat spreader that extends through the substrate core from the top surface to a level below the bottom surface, thermally coupled to a system heat sink, allowing for efficient heat dissipation without increasing the product size, and can be formed from cost-effective materials like flat metal or ceramic plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laminate materials are used in substrates, then manufacturing cost is reduced and supply base is mature, but thermal properties deteriorate
Solution Approach 1:
The substrate employs a composite structure combining laminate material with an integrated heat spreader made of thermally conductive material (such as metal or ceramic). This composite approach allows the substrate to retain the cost advantages of laminate materials while incorporating the superior thermal conductivity of metal or ceramic components, thereby resolving the contradiction between manufacturing cost and thermal properties.
2Temperature
If a heat spreader is integrated in the substrate, then thermal conductivity is enhanced, but manufacturing complexity increases
Solution Approach 1:
The heat spreader is merged with the substrate to form an integrated structure where the heat spreader becomes an inherent part of the substrate assembly. This integration eliminates the need for separate heat spreader components and reduces the number of assembly steps, thereby enhancing thermal conductivity while minimizing manufacturing complexity.
Solution Approach 2:
The integrated heat spreader serves multiple functions: it acts as both a thermal management component and a structural element of the substrate. This multi-functionality reduces the overall component count and simplifies the manufacturing process, as the heat spreader simultaneously provides thermal conduction and structural support.
3Adaptability or versatility
If a pedestal is formed in the system heat sink to accommodate both connecting structures and heat dissipation, then connection requirements are met, but manufacturing cost increases and dimensional uncertainty increases
Solution Approach 1:
The pedestal function is extracted from the system heat sink and transferred to the substrate itself. The substrate's integrated heat spreader directly contacts the heat generating device and provides thermal conduction, while separate connecting structures extend through the substrate to establish electrical connections with the PCB. This extraction eliminates the need for a complex pedestal structure in the heat sink, reducing manufacturing cost and dimensional uncertainty.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated heat spreader design enhances thermal conductivity, reducing the risk of semiconductor die failure and lowering the cost of the system heat sink assembly by enabling efficient heat dissipation while simplifying the manufacturing process.
Implementation Method 1
The heat spreader 24 is in contact with both the top heat plate 20 and the bottom heat plate 22, and coupled to the substrate core 14 via an adhesive 26
Data Source
AI summary
The present disclosure relates to a substrate with an integrated heat spreader. The disclosed substrate includes a substrate core, at least one connecting structure, and a heat spreader. The substrate core has a top surface and a bottom surface opposite the top surface of the substrate. The at least one connecting structure extends through the substrate core from the top surface of the substrate core to the bottom surface of the substrate core. And the heat spreader extends through the substrate core from the top surface of the substrate core to a bottom level that is below the bottom surface of the substrate core.