Integrated Heat Spreader Structural Support

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Solution Overview

Problem

In electronic devices, the combination of a cooling mechanism and structural support often occupies valuable space, increasing the device's size and reducing internal component space due to the need for separate components for heat dissipation and structural support.

Innovation Solution

A multi-dimensional heat spreader that provides both heat dissipation and structural support to the outer housing of electronic devices, eliminating the need for a distinct support frame by being structurally engaged with the housing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If separate cooling mechanism and structural support components are used, then heat dissipation function is achieved, but device size increases and internal space is reduced

Engineering Contradiction:

Improveheat dissipationVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent combines the cooling mechanism and structural support into a single integrated heat spreader component. The heat spreader is attached to the processor to conduct heat away while simultaneously serving as a structural element within the device, thereby eliminating the need for separate cooling and support components and reducing overall device volume.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat spreader performs multiple functions: it acts as a thermal management component to dissipate heat from the processor, while also serving as a structural support element within the device housing. This multi-functionality reduces the total number of components needed and optimizes internal space utilization.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If separate cooling mechanism and structural support components are used, then heat dissipation function is achieved, but internal component space is reduced

Engineering Contradiction:

Improveheat dissipationVSAvoidinternal space

Core Design Contradiction:

TemperatureVSVolume of stationary object

Solution Approach 1:

The patent merges the cooling mechanism and structural support into a single integrated heat spreader component. The heat spreader is attached to the processor to conduct heat away while simultaneously serving as a structural element within the device, thereby eliminating the need for separate cooling and support components and reducing overall device volume.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively manages heat dissipation while maintaining a thin profile for electronic devices, optimizing internal space usage and reducing the overall size of the device.

Implementation Method 1

a heat spreader to conduct heat away from the processor

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10667432B2Heat spreader to structurally support an outer housing

Publication Date: 2020.05.26 HEWLETT PACKARD DEVELOPMENT COMPANY LP

AI summary

In some examples, an electronic device includes an outer housing and a heat spreader inside an inner chamber defined by the outer housing. The heat spreader is structurally engaged to the outer housing to provide structural support for the outer housing, and the heat spreader is to spread heat along two different directions. Electronic components are in thermal contact with a surface of the heat spreader to transfer heat produced by the electronic components to the heat spreader.