Integrated Heat Spreader for Multi-Chip Package Height Variation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The height variation in multi-chip packages (MCPs) complicates thermal management, as current techniques compensate for height differences using thicker thermal interface materials (TIMs), which degrade thermal performance, leading to reduced cooling capacity and increased risk of component failure.

Innovation Solution

The implementation of a stiffener plate with openings for individual integrated heat spreaders, allowing a minimized TIM1 thickness and shifting the compensation for height variation to a second-level thermal interface material (TIM2) layer, which is thicker and positioned further away from the heat source, thereby maintaining thermal performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If thicker TIM1 is used to compensate for height variation, then height variation is absorbed, but thermal performance degrades

Engineering Contradiction:

Improveheight variation compensationVSAvoidthermal performance

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The thermal interface material system is segmented into two distinct layers: TIM1 with minimized thickness for optimal thermal performance, and TIM2 with increased thickness for height variation compensation. This segmentation allows each layer to perform its specific function without compromising the other, resolving the contradiction between height compensation and thermal performance.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The compensation for height variation is shifted from the vertical dimension at the heat source interface (TIM1) to a different vertical position (TIM2 layer further from the die). This dimensional redistribution allows height compensation to occur away from the critical thermal interface, maintaining thermal performance while achieving mechanical compatibility.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If thicker TIM1 is used to compensate for height variation, then component height differences are accommodated, but cooling capacity is reduced

Engineering Contradiction:

Improveheight variation accommodationVSAvoidcooling capacity

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The thermal interface is segmented into TIM1 (thin, high thermal performance) and TIM2 (thick, height compensation). This allows the system to accommodate height variations through TIM2 while TIM1 maintains optimal thermal contact, preserving cooling capacity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

TIM2 acts as an intermediary layer that mediates between the height variation of components and the thermal requirements of TIM1. It provides the necessary mechanical compliance without interfering with the thermal performance of the primary thermal interface.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If thicker TIM1 is used to compensate for height variation, then manufacturing flexibility increases, but thermal resistance increases

Engineering Contradiction:

Improvemanufacturing flexibilityVSAvoidthermal resistance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The thermal interface is divided into two functional segments: TIM1 for thermal conduction with minimized thickness, and TIM2 for mechanical compliance with increased thickness. This segmentation enables manufacturing flexibility through TIM2 while maintaining low thermal resistance in TIM1.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the thermal interface are assigned different qualities: TIM1 has high thermal conductivity and minimal thickness for optimal heat transfer, while TIM2 has greater thickness and compliance for manufacturing flexibility. This local differentiation resolves the contradiction between ease of manufacture and thermal performance.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances thermal performance by minimizing TIM1 thickness and reducing the impact of height variation, resulting in improved heat transfer and reduced risk of component failure, with thermal performance improved by at least 30% compared to existing MCPs.

Implementation Method 1

The TIM1s are applied between the die and the integrated heat spreader to lower package thermal resistance

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

An integrated heat spreader (IHS) is attached to a substrate above component 103 and component 104

Methodology Applied

Scientific EffectHeat spreading: Conduction (thermal)

Implementation Method 3

The IHS 102 is attached to a substrate 101 above component 103 and component 104

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS9646910B2Integrated heat spreader that maximizes heat transfer from a multi-chip package

Publication Date: 2017.05.09 INTEL CORP

AI summary

In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.