Integrated Heat Dissipation Substrate With 3D Coolant Channel Core
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Solution Overview
Problem
Existing heat dissipation substrates for high-power semiconductor devices face challenges in efficiently integrating heat dissipation devices without damaging the circuit board's synthetic resin insulating layer, and in achieving sufficient heat conduction resistance to prevent circuit defects.
Innovation Solution
A manufacturing method for a heat dissipation device-integrated heat dissipation substrate that involves preparing overlapping metal base plates with a three-dimensional structure for a heat media circulation space, coupling these plates via brazing, and bonding an electrode metal plate with a groove pattern to the integrated base using insulating resin, ensuring the integration of heat dissipation devices like water jackets or heat pipes without damaging the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation devices are separately attached to the printed circuit board, then heat dissipation effect is improved, but heat conduction resistance at coupling surface increases and circuit defects may occur
Solution Approach 1:
The patent integrates the heat dissipation device directly into the printed circuit board structure by forming a through-hole that penetrates the board and housing both the electrode pattern and heat dissipation device components within the same substrate. This merging eliminates the separate attachment process, reduces coupling surface heat conduction resistance, and prevents circuit defects while maintaining effective heat dissipation.
2Temperature
If brazing process is used to bond rear surface and water jacket, then heat dissipation is improved, but process temperature reaches 600°C which may damage synthetic resin insulating layer
Solution Approach 1:
The patent performs the heat dissipation device integration during the board manufacturing process itself, before the synthetic resin insulating layer is applied or before final assembly. By pre-forming the through-hole and integrating heat dissipation structures into the board core, the need for high-temperature brazing after board completion is eliminated, thus protecting the insulating layer from thermal damage.
3Power
If high-power semiconductor devices are mounted, then device capability is improved, but heat generation increases causing malfunction and reliability problems
Solution Approach 1:
The patent combines the electrode pattern and heat dissipation device into a single integrated structure within the printed circuit board. This integration creates direct thermal coupling between the high-power semiconductor device mounting area and the heat dissipation components, enabling efficient heat transfer away from the device while maintaining electrical connectivity, thus allowing high-power operation without thermal-related malfunctions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient manufacturing of heat dissipation substrates with integrated heat dissipation devices, ensuring effective heat transfer and preventing damage to the circuit board's insulating layer, thus enhancing the reliability and efficiency of high-power semiconductor devices.
Implementation Method 1
a metal base integrated with a heat media circulation space for absorbing and dissipating heat transferred from the plurality of electrodes
Implementation Method 2
base coupling step of coupling opposing inner surfaces of the first base and the second base against each other
Data Source
AI summary
A manufacturing method of a heat dissipation device-integrated heat dissipation substrate for a semiconductor includes a base processing step of preparing a first base plate and a second base plate in the form of metal plates that overlap each other and constitute a part of a metal base, and providing a first base and a second base in which a three-dimensional structure forming the heat media circulation space is formed on an inner surface of at least one of the first base plate and the second base plate, a base coupling step of coupling opposing inner surfaces of the first base and the second base against each other to form heat dissipation device-integrated base, an electrode metal plate preparation step of processing an electrode metal plate to form a groove pattern, and preparing an electrode metal plate configured to cover an area corresponding to at least one circuit unit, and an electrode metal plate bonding step of bonding, via insulating resin, the electrode metal plate to an upper surface of the heat dissipation device-integrated base.