Integrated Hybrid-Direct Coupler Vertical Stacking
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Solution Overview
Problem
Conventional wireless transmitters with separate hybrid and directional couplers suffer from increased transmission loss and spatial inefficiency due to serial architecture, which degrades performance and requires extra printed circuit board area.
Innovation Solution
An integrated hybrid-direct coupler is proposed, where a hybrid coupler and directional coupler are vertically integrated with quarter-wave metallic strips dielectrically coupled, allowing the directional coupler to sample the output signal directly without serial connection, thereby minimizing transmission loss and reducing board area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If separate hybrid coupler and directional coupler are used in serial architecture, then the transmit signal path can be implemented, but transmission loss increases
Solution Approach 1:
The patent combines the hybrid coupler and directional coupler into a single integrated device with shared metallic strips and dielectric layers. The hybrid coupler and directional coupler functionality are merged in one structure, eliminating the need for separate serial connections and reducing transmission loss at interfaces between components.
Solution Approach 2:
The patent transitions from a planar serial architecture to a three-dimensional integrated structure where metallic strips are stacked vertically across multiple dielectric layers. This dimensional change allows the hybrid and directional coupler functions to coexist in the same spatial footprint without serial connection losses.
2Area of stationary object
If separate hybrid coupler and directional coupler are used, then the required functions can be performed, but printed circuit board area increases
Solution Approach 1:
The patent implements a nested structure where the directional coupler metallic strips are positioned within the same vertical space as the hybrid coupler metallic strips. The components are nested across multiple dielectric layers, allowing both functions to occupy the same PCB area efficiently.
Solution Approach 2:
By utilizing vertical stacking across multiple dielectric layers, the patent converts a two-dimensional PCB layout problem into a three-dimensional structure. This allows both hybrid and directional coupler functions to be implemented in the same PCB footprint, dramatically improving spatial efficiency.
3Reliability
If directional coupler is connected in series to hybrid coupler, then signal sampling can be performed, but transmission loss is incurred
Solution Approach 1:
The directional coupler is merged with the hybrid coupler in the same integrated structure, allowing signal sampling to occur directly from the combined output without requiring a separate serial connection. This eliminates the additional transmission loss that would occur at the connection interface between separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated coupler achieves improved transmission efficiency and spatial efficiency by eliminating transmission loss and reducing manufacturing costs through a parallel architecture that combines the functions of both couplers in a single device.
Implementation Method 1
The hybrid coupler may include a first quarter-wave metallic strip dielectrically coupled to a second quarter-wave metallic strip
Implementation Method 2
The first quarter-wave metallic strip may receive a first input signal. The second quarter-wave metallic strip may receive a second input signal, and it may superimpose the first quarter-wave metallic strip along a vertical space
Implementation Method 3
the directional coupler may sense a sample of the output signal of the hybrid coupler through direct dielectric coupling and without relying on a serial connection thereto
Data Source
AI summary
An integrated coupler may vertically integrate a hybrid coupler and a directional coupler. The hybrid coupler may include a first quarter-wave metallic strip dielectrically coupled to a second quarter-wave strip. The directional coupler may include the second quarter-wave metallic strip dielectrically coupled to a third metallic strip. The first quarter-wave metallic strip may receive a first input signal. The second quarter-wave metallic strip may receive a second input signal, and it may superimpose the first quarter-wave metallic strip along a vertical space, so as to combine power received from the first input signal and the second input signal to form an output signal. The third quarter-wave metallic strip may superimpose the second quarter-wave metallic strip along the vertical space, so as to sample the output signal of the second quarter-wave metallic strip.